Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Standard of Excellence: The Future of Fabrication—From Art to Automation

06/24/2026 | Anaya Vardya -- Column: Standard of Excellence
In the earliest days of PCB manufacturing, every build was part science, craftsmanship, and prayer. Veteran fabricators could smell a bad batch of laminate before it failed, sense a process drift before it showed up on a chart, and diagnose a plating problem by sight. That human intuition, the art of fabrication, was the foundation of our industry. The next generation of excellence is about magnifying the human touch through intelligent automation, data-driven control, and a digital mindset that ties every process, operator, and outcome together.

EIPC Summer Conference 2026: AI, Robots, and Historic Vilnius, Lithuania

06/15/2026 | Marcy LaRont, I-Connect007
Historic downtown Vilnius, Lithuania, hosted the sold-out EIPC Summer Conference, June 9–10, where 175 participants gathered at the AC Hotel, including representatives from the Global Electronics Association, FED, and four other industry associations. This year also included representation from 14 European PCB companies, and one—TTM— from the U.S., something that hasn’t happened for quite some time.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Technica USA Welcomes ASMPT Support Team for SIPLACE SX Demo Days Event

06/05/2026 | Technica USA
Technica USA, in partnership with ASMPT, hosted a successful Demo Days event this week at its San Jose facility.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in