Fresh PCB Concepts: PCB Plating Process Overview
The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
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March 13, 2019 | DownStream TechnologiesEstimated reading time: Less than a minute
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The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
Rules of Thumb: A Primer
11/14/2024 | Andy Shaughnessy, Design007 MagazineMany industry-wide rules of thumb are based on DFM constraints or formulas, but others are based on tribal knowledge. In this interview, Andy Shaughnessy sits down with our contributors Kris Moyer and Kelly Dack to discuss the role of rules of thumb, when to employ them, and when it’s time to do the math.
Elementary, Mr. Watson A Designer's Dilemma—Metric or Imperial Units?
11/07/2024 | John Watson -- Column: Elementary, Mr. WatsonIn the early 1800s, as trains began to spread across the United States, different companies built their tracks in ways that made sense to them. They chose their track widths (gauges) with no set standard. Some tracks were about four feet wide, with others at five or even six feet. Each company thought their choice was best, but this led to a big problem: Trains from one track couldn't run on another if the gauges didn't match. Often, trains had to stop at the state line for all their goods and passengers to switch trains, which cost extra time and money.
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
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