Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
TopLine Exhibits CCGA Solutions at NEPCON China Shanghai
March 21, 2019 | TopLineEstimated reading time: 1 minute
TopLine will exhibit a range of CCGA PCBA assembly solutions at NEPCON China Shanghai, in stand #1F04, April 24-26. This will be TopLine’s 6th straight year at NEPCON China Shanghai. Featured products will include CCGA - Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” states Martin Hart, TopLine CEO.
NEPCON China Shanghai 2019 will be held April 24 – 26 at the Shanghai World EXPO Exhibition & Convention Center. NEPCON China is a prestigious professional trade platform and exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation). It brings together more than 500 renowned brands and 30,000 local and international visitors. TopLine has been active in promoting its products in the China market for more than 20 years.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. Contact TopLine
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.