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TopLine Exhibits CCGA Solutions at NEPCON China Shanghai
March 21, 2019 | TopLineEstimated reading time: 1 minute
TopLine will exhibit a range of CCGA PCBA assembly solutions at NEPCON China Shanghai, in stand #1F04, April 24-26. This will be TopLine’s 6th straight year at NEPCON China Shanghai. Featured products will include CCGA - Column Grid Arrays and Daisy Chain BGA test vehicles. TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” states Martin Hart, TopLine CEO.
NEPCON China Shanghai 2019 will be held April 24 – 26 at the Shanghai World EXPO Exhibition & Convention Center. NEPCON China is a prestigious professional trade platform and exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation). It brings together more than 500 renowned brands and 30,000 local and international visitors. TopLine has been active in promoting its products in the China market for more than 20 years.
About TopLine
TopLine manufactures a wide range of Daisy Chain test components, Column Grid Arrays, Particle Impact Vibration Dampers and engineering evaluation kits for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. Contact TopLine
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