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Barry Industries Introduces Ultra Broadband Chip Termination
March 21, 2019 | Barry IndustriesEstimated reading time: 1 minute
Barry Industries announces the introduction of an ultra-broadband, DC to 44GHz chip termination for microwave applications. The uniquely designed TS0808ZZ-50R0JN-2S is surface mountable (SMT) and has been tested to show a typical return loss of 20dB or better over a DC to 44GHz bandwidth. Barry Industries is an ISO9001:2015 certified, ITAR registered manufacturer of high-quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
The TS0808ZZ-50R0JN-2S is a compact, 0808 (2.032 x 2.032mm) size ‘flip-chip’ constructed of robust thick film on Aluminum Nitride with solderable terminals. Face down mounting keeps the resistive film co-planar with board traces, thus minimizing parasitic capacitance. This 50-ohm impedance device is RoHS/ REACH compliant and is rated at 1W on a 100°C mounting surface temperature.
The TS0808ZZ-50R0JN-2S is available in bulk or tape and reel packaging for high speed pick and place assembly.
Data sheet, S-Parameters, outline drawings and full documentation of the TS0808ZZ-50R0JN-2S testing procedure are available on the Barry website.
With its ultra-broadband performance, stable 50Ω resistor element and 1.22:1 Max VSWR, the TS0808ZZ-50R0JN-2S is ideal for applications such as 5G wireless point-to-point backhaul.
Since 1977, Barry Industries, an ISO9001:2015 certified, ITAR registered company, has been supplying the defense, medical and communications industries with highest quality thick film chip resistors, terminations, attenuators high temperature co-fired ceramic (HTCC) packaging.
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