Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Barry Industries Introduces Ultra Broadband Chip Termination
March 21, 2019 | Barry IndustriesEstimated reading time: 1 minute
Barry Industries announces the introduction of an ultra-broadband, DC to 44GHz chip termination for microwave applications. The uniquely designed TS0808ZZ-50R0JN-2S is surface mountable (SMT) and has been tested to show a typical return loss of 20dB or better over a DC to 44GHz bandwidth. Barry Industries is an ISO9001:2015 certified, ITAR registered manufacturer of high-quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
The TS0808ZZ-50R0JN-2S is a compact, 0808 (2.032 x 2.032mm) size ‘flip-chip’ constructed of robust thick film on Aluminum Nitride with solderable terminals. Face down mounting keeps the resistive film co-planar with board traces, thus minimizing parasitic capacitance. This 50-ohm impedance device is RoHS/ REACH compliant and is rated at 1W on a 100°C mounting surface temperature.
The TS0808ZZ-50R0JN-2S is available in bulk or tape and reel packaging for high speed pick and place assembly.
Data sheet, S-Parameters, outline drawings and full documentation of the TS0808ZZ-50R0JN-2S testing procedure are available on the Barry website.
With its ultra-broadband performance, stable 50Ω resistor element and 1.22:1 Max VSWR, the TS0808ZZ-50R0JN-2S is ideal for applications such as 5G wireless point-to-point backhaul.
Since 1977, Barry Industries, an ISO9001:2015 certified, ITAR registered company, has been supplying the defense, medical and communications industries with highest quality thick film chip resistors, terminations, attenuators high temperature co-fired ceramic (HTCC) packaging.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.