Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Barry Industries Introduces Ultra Broadband Chip Termination
March 21, 2019 | Barry IndustriesEstimated reading time: 1 minute
Barry Industries announces the introduction of an ultra-broadband, DC to 44GHz chip termination for microwave applications. The uniquely designed TS0808ZZ-50R0JN-2S is surface mountable (SMT) and has been tested to show a typical return loss of 20dB or better over a DC to 44GHz bandwidth. Barry Industries is an ISO9001:2015 certified, ITAR registered manufacturer of high-quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
The TS0808ZZ-50R0JN-2S is a compact, 0808 (2.032 x 2.032mm) size ‘flip-chip’ constructed of robust thick film on Aluminum Nitride with solderable terminals. Face down mounting keeps the resistive film co-planar with board traces, thus minimizing parasitic capacitance. This 50-ohm impedance device is RoHS/ REACH compliant and is rated at 1W on a 100°C mounting surface temperature.
The TS0808ZZ-50R0JN-2S is available in bulk or tape and reel packaging for high speed pick and place assembly.
Data sheet, S-Parameters, outline drawings and full documentation of the TS0808ZZ-50R0JN-2S testing procedure are available on the Barry website.
With its ultra-broadband performance, stable 50Ω resistor element and 1.22:1 Max VSWR, the TS0808ZZ-50R0JN-2S is ideal for applications such as 5G wireless point-to-point backhaul.
Since 1977, Barry Industries, an ISO9001:2015 certified, ITAR registered company, has been supplying the defense, medical and communications industries with highest quality thick film chip resistors, terminations, attenuators high temperature co-fired ceramic (HTCC) packaging.
Share on:
Suggested Items
Scanfil Signs Agreement with Leardal Medical for Malaysian Factory
03/12/2025 | ScanfilLaerdal Medical and Scanfil have signed a framework agreement for manufacturing at Scanfil’s newly acquired Malaysian factory in Johor Bahru. Scanfil announced an investment of EUR 4.3 million in the factory in January to meet its high customer demand.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing
03/10/2025 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG. Sartorius is a leading international provider to the biopharmaceutical research and medical industry.
BEST Inc. BGA Reballing Service Offers Unsurpassed Solutions for Commercial, Military and Aerospace Applications
03/05/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce it has expanded its BGA reballing solutions. Our BGA reballing process has been perfected over 20 plus years of reballing BGAs for electronic manufacturers across the country.
Altus Enhances Traceability for Leading CEM
03/04/2025 | Altus GroupAltus Group, a leading supplier of capital equipment for the electronics industry, has helped Active PCB Solutions, a UK-based Contract Electronics Manufacturer, enhance its traceability with the installation of the YJ Link YLM Laser Marker.