Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Smart Automation: The Journey of a Component Through an SMT Factory
Powering the Future: Why Thermal Management Defines the Future of Electronics
Indium Experts to Present at PCIM Europe 2019
March 27, 2019 | Indium CorporationEstimated reading time: 2 minutes
Two Indium Corporation experts will present during PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.
Seth Homer, product manager engineered solders, will present The Impact of Solder Alloy Integrity in Power Electronics, which discusses the impact of solder on power electronics designs amid challenges for improved reliability and performance. Some of the criteria to be discussed include alloy homogeneity, purity, and the impact of dimensional tolerances.
Karthik Vijay, technical manager, Europe, Africa, and the Middle East, will present Automotive Electrification: Solder Matrix Reinforcement Solution for Increased Reliability. The paper examines the positive effect of enhanced thermal cycling reliability in IGBT power modules for substrate-to-baseplate attach, by incorporating a composite matrix in the solder preform. The matrix provides constant bondline control and reinforces the strength of the interconnect by enhancing creep resistance. These attributes are highly valuable to power module platforms in EVs and HEVs that operate at high voltages of 300+ Volts with increased thermal cycling reliability requirements.
Homer has worked with Indium Corporation for more than 20 years, serving in both manufacturing operations and marketing roles. He has been responsible for many of the products within the engineered solders product offering and is currently working with the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with manufacturing internally to help support current production demand and future product development.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.
At the show, Indium Corporation will feature the high-reliability products reviewed in Homer and Vijay’s presentations, as well as other high-performance thermal interface materials to improve first yields. For more information about Indium Corporation’s experts’ recent work, visit www.indium.com/techlibrary or look for them at the show in hall 6, stand 108 as well as their E-Mobility stand in Hall 6.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Frank Sommer Discusses Selective Soldering Innovations for EVs
04/10/2026 | Real Time with... APEX EXPODan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.