Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Indium Experts to Present at PCIM Europe 2019
March 27, 2019 | Indium CorporationEstimated reading time: 2 minutes
Two Indium Corporation experts will present during PCIM Europe 2019 from May 7-9 in Nuremberg, Germany.
Seth Homer, product manager engineered solders, will present The Impact of Solder Alloy Integrity in Power Electronics, which discusses the impact of solder on power electronics designs amid challenges for improved reliability and performance. Some of the criteria to be discussed include alloy homogeneity, purity, and the impact of dimensional tolerances.
Karthik Vijay, technical manager, Europe, Africa, and the Middle East, will present Automotive Electrification: Solder Matrix Reinforcement Solution for Increased Reliability. The paper examines the positive effect of enhanced thermal cycling reliability in IGBT power modules for substrate-to-baseplate attach, by incorporating a composite matrix in the solder preform. The matrix provides constant bondline control and reinforces the strength of the interconnect by enhancing creep resistance. These attributes are highly valuable to power module platforms in EVs and HEVs that operate at high voltages of 300+ Volts with increased thermal cycling reliability requirements.
Homer has worked with Indium Corporation for more than 20 years, serving in both manufacturing operations and marketing roles. He has been responsible for many of the products within the engineered solders product offering and is currently working with the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with manufacturing internally to help support current production demand and future product development.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in Systems Science and Industrial Engineering from Binghamton University, State University of New York.
At the show, Indium Corporation will feature the high-reliability products reviewed in Homer and Vijay’s presentations, as well as other high-performance thermal interface materials to improve first yields. For more information about Indium Corporation’s experts’ recent work, visit www.indium.com/techlibrary or look for them at the show in hall 6, stand 108 as well as their E-Mobility stand in Hall 6.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.