Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
PVA to Exhibit Conformal Coating Systems at the ElectronTechExpo
March 27, 2019 | PVAEstimated reading time: 1 minute
PVA will exhibit at the ElectronTechExpo, scheduled to take place April 15-17, 2019 in Moscow, Russia. The company will showcase the Delta 6 conformal coating/dispensing system known for the ability to dispense the Belhim material UR231 as well as the ST100S and CAM200 manual conformal coating systems in Pavilion 3, Hall 13, Stand B535.
The ST100S is a digital shot timer used for syringe dispensing. This compact controller is an economic and ergonomic solution for improving the waste, inaccuracies, and clean up associated with many manual processes. The ST100S is ideal for chemistries packaged in syringes such as solder paste, UV adhesives, and masking material.
The ST100S has many integrated features including:
- Digital timer with LED display and 0.001 – 99.99 second time range
- Manual, timed, or teach modes
- Adjustable analog vacuum suck-back for clean cycle stops
- Integrated pressure control
- Electric foot pedal and power cord
- Built in regulator and gauge
- Sample PVA needle tips / 30cc syringe and air cap
- 9-pin serial port connection
The CAM200 is an all plastic handheld valve suitable for dispensing low to medium viscosity cyanoacrylate adhesives and anaerobic chemistries via a unique floating diaphragm process. Depressing the CAM200 finger switch allows a diaphragm to flex and permits material to flow through the valve.
The diaphragm will terminate the dispensing process as the finger switch is released. The valve’s ergonomic wand design makes handheld dispensing easier than ever. The CAM200 can be utilized in applications requiring dots, beads, encapsulation or potting.
About PVA
PVA is a global supplier of conformal coating systems, innovative fluid dispensing solutions and precision valve technology. PVA’s customer driven solutions are utilized worldwide in industries ranging from solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing, and consumer electronics. Throughout the changing global manufacturing landscape, PVA remains committed to providing our customers with exceptional products and industry-leading global support.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.