-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO North America to Hold Technology Days in Kentucky
March 29, 2019 | SEHO North America, Inc.Estimated reading time: 1 minute

SEHO North America, Inc. will hold its 2019 Technology Days in conjunction with guest presenters from Stannol LLC (soldering flux technologies), DCT USA LLC (process cleaning technologies), KIC (thermal profiling) and Scienscope International USA (inspection solutions). The event is scheduled to take place May 7–8, 2019 at SEHO’s North America Technology Center in Erlanger, Kentucky.
If you need best practices you can put to work immediately, the SEHO Technology Days are the place to be. SEHO Technology Days are designed to provide a perfect balance of theory and practical application. In addition to hands on trainings, this year’s event will include presentations from leading flux, solder and equipment suppliers. Industry experts will present their latest findings and share expert insight on the latest industry issues and trends.
Topics of discussion will include typical challenges in electronics production as well as methods to optimize soldering processes to approach a zero-defect production. Experts will provide tips for board and pallet design to improve product quality while reducing production cost.
Guest presenters also will discuss new applications in soft soldering of aluminium and aluminium alloys, and will highlight the differences between water-based fluxes and alcohol-based fluxes as well as the challenges when working with these fluxes. Another topic will be the complexity of the cleaning process in electronics manufacturing. The need for profiling the wave soldering process will be discussed and various types of wave solder profiling configurations will be showcased. A review of the use of X-ray for inspecting PCBs and components in a non-destructive test environment will complete the exciting program of the two-days event.
As a special highlight, SEHO’s new StartSelective entry-level selective soldering systems will be introduced.
The technology days are part of the successful SEHO Academy program conducted both at SEHO Germany and SEHO USA with more than 1,000 satisfied attendees worldwide. Knowledgeable employees can optimize processes to improve production throughput, reduce cycle times, improve the level of quality, reduce failures, and cut down overall cost.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.