-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha Opens Tech and Applications Center in Taiwan
March 29, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions officially opened a Global Development Application Center (GDAC) at No. 20, Andong Rd., Zhongli District, Taoyuan City, Taiwan R.O.C on March 19, 2019. Scot Benson, President and Chief Operating Officer, and Joe D’Ambrisi, Senior Vice President, accompanied Harry Yang, General Manager for Taiwan, cut the ribbon to officially open the new facility. Several important customers, tier one manufacturers, and industry representatives joined the company’s top management for the historic moment. The advanced technology and application center will house sales, technical service, customer service, and office personnel alongside the laboratory staff.
Harry Yang said, “With MacDermid Alpha Taiwan's unique role as a chemical and materials supplier to all steps of the electronics manufacturing supply chain, this US$ 4 million investment to build a highly optimized technical center is the next step in a long journey to our goals. With these new capabilities, we can foster not only local, but also cross-strait development of advanced printed circuit board and IC substrate manufacturing processes. Additionally, the facility enables study of MacDermid Alpha’s assembly materials, semiconductor packaging processes, and wafer interconnection in a way that optimizes every material within an electronic device.”
The first floor of the applications development technology center houses an advanced IC substrate and metallization process pilot line which features equipment specific for ultra-fine line processing. The second floor houses our wafer level packaging applications laboratory with capabilities for the testing of solder ball, micro solder spheres, reflow metrology, and a fully functional tool for wafer level tin bumping. Production-scale wet processing equipment lines are located on the third floor, along with a complete chemical analysis laboratory containing high-precision instruments for comprehensive customer service. Following the company’s emphasis on innovation and service, the facility will host training of regional MacDermid Alpha Taiwan technical service staff, conduct in-depth product development and pilot studies, and leverage the advanced equipment available on-site and at our customers in the area. Engineer training and project planning will be conducted on the fourth floor R&D training center.
Yang continued, “We really hope that through these investments and new capabilities, we can assist regional companies achieve their goals and allow new growth opportunities in Taiwan’s electronics industry as a whole.”
About MacDermid Alpha Electronics Solutions:
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.