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Aqueous Technologies Opens Registration for Reliability of Circuit Assemblies Workshops
April 2, 2019 | Aqueous TechnologiesEstimated reading time: Less than a minute
Aqueous Technologies has announced that the registration is open for the Reliability of Circuit Assemblies Workshops to be held in Baltimore Maryland (May 21), Raleigh North Carolina (May 23), Melbourne Florida (June 25), and Tampa Florida (June 27).
Speakers include Mike Konrad of Aqueous Technologies, Kalyan Nukala and Umut Tosun of Zestron, Terry Munson and Eric Camden of Foresite, Dr. Rakesh Kumar and Lamar Young of Specialty Coating Systems, and Tony Lentz of FCT Solder.
Each of the four workshops will cover best practice reliability-based topics including cleaning, new IPC cleanliness testing standards, conformal coating, soldering materials, failure analysis, and more.
Breakfast and lunch will be provided. Registration is free but seating is limited.
Workshop information and registration are available at www.reliabilityworkshop.com
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
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