-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Tips & Tricks: Wave Solder Bridging
April 3, 2019 | Jason Fullerton, MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute

Wave solder bridging is the most difficult defect to troubleshoot because it has a number of potential causes. The key is to understand the role of flux during wave contact—reducing the surface tension of the solder to reduce the tendency to bridge between pins as the board leaves the wave. Bridging occurs when the flux has been chemically depleted before exiting the wave. This can be a function of the flux and process.
With respect to flux, in general, fluxes with higher activity levels are more resistant to bridging. This means that no-clean fluxes can be more likely to result in bridging, especially with older formulations. Newer flux formulations are available that have higher levels of performance while still meeting the requirements of no-clean classification.
Regarding the process, the flux loading and total thermal input to the board are key factors. An inadequate amount of flux can result in flux exhaustion before wave exit. Excessively high thermal inputs can also lead to bridging with three factors to measure. Preheat temperature is the first, contact time on the wave is the second, and solder pot temperature is the third. The optimal values for each should be available on the data sheet for any flux, and they will be different for every flux formulation.
There are other reasons outside of flux and process that can lead to bridging. The design of masking pallets can cause bridging if there is inadequate clearance around the devices. The PCB layout can also cause bridging if rows of leads are unable to be processed through the wave in the proper orientation (orthogonally and not parallel to the wave). These factors may not be able to be overcome through process optimizations or flux selection.
Jason Fullerton is the customer technical support engineer at the Assembly Division of MacDermid Alpha Electronics Solutions.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,