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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

For Cybersecurity Certification, a Pause Is Not a Pass

10/13/2026 | Thomas Graham, Ph.D., Redspin
Until July, contractors across the U.S. defense industry had circled Nov. 10 as a watershed date marking the planned start of Phase 2 of the Cybersecurity Maturity Model Certification rollout. CMMC is a Department of Defense initiative intended to validate that contractors have implemented the security requirements in the National Institute of Standards and Technology’s Special Publication 800-171 Rev. 2. For contractors who store, process, and/or transmit controlled unclassified information, implementation is not optional. Defense Federal Acquisition Regulation (DFARS) 252.204-7012 has been a contractual obligation since Dec. 31, 2017.

Merlin Flex Achieves ISO27001 Accreditation

10/02/2026 | Merlin Flex Ltd
Merlin Flex Ltd has achieved ISO 27001 accreditation, further strengthening its commitment to information security and the protection of customer and business-critical data.

CACI Wins Contract to Advance CENTCOM Information Advantage and Irregular Warfare Operations

09/28/2026 | CACI International Inc.
CACI International Inc announced that it has received a one-year plus four option periods award to support U.S. Central Command (USCENTCOM) and its mission partners across a demanding and rapidly changing mission environment. The award has a ceiling of $1.5 billion.      

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

It’s Only Common Sense: Why Should They Take Your Call?

09/14/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Think about the customer receiving your sales call. She’s dealing with material shortages, changing laminate allocations, extended component lead times, tariff questions, unpredictable transportation costs, and management pressure to protect both delivery and margin. Then the phone rings, and a salesperson asks, “Do you have anything I can quote?” It’s time to rethink that relationship. Call customers because you have information that could help them make a better decision, not because you want an order. Instead of asking, “What can you give me?” you are saying, “Here is something you should know.” Now you are a resource, not an interruption.
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