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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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Firstronic Grand Rapids Facility Recertified to ISO 13485:2016
April 8, 2019 | Firstronic LLCEstimated reading time: Less than a minute
Electronics manufacturing services (EMS) provider Firstronic LLC’s Grand Rapids, Michigan facility passed its surveillance audit for ISO 13485:2016, the medical quality standard, and was recertified by Intertek on March 16.
Firstronic’s Juarez, Mexico facility will undergo surveillance audits for the automotive IATF 16949 standard in April and ISO 13485:2016 in June.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Caught in the ESG Crossfire: Transparency, Comparability, and Impact
10/31/2025 | Marina Hornasek-Metzl, AT&S AGIn the evolving landscape of corporate responsibility, Environmental, Social, and Governance (ESG) reporting has become a cornerstone of stakeholder communication. Yet, as organizations strive to meet growing regulatory and investor demands, they find themselves caught between the need for robust ESG disclosure, the persistent lack of comparability across reports, and the elusive goal of translating ESG efforts into tangible business value.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.
Fall 2025 Issue of Community Magazine Now Available
10/20/2025 | I-Connect007Now available! The Fall 2025 issue of Community Magazine delivers another stellar issue packed with member profiles, workforce development and sustainability wins, policy updates, factory data standards, personality features, news from around the world, and much more..
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.