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Indium to Exhibit at PCIM 2019
April 9, 2019 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its InFORMS ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Indium Corporation’s InFORMS ESM02 is a reinforced matrixed solder composite that produces a high-reliability solder joint with increased thermal and mechanical performance for the development of new, or the improvement of existing, applications.
Previous InFORMS technology was only applied at the baseplate level; however, new production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Availability in ribbon and preforms
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
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