Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Juki Hires Chris Briggs New Smart Solutions Engineer
April 9, 2019 | Juki Automation Systems (JAS), Inc.Estimated reading time: 1 minute
Juki Automation Systems (JAS), Inc. has added Chris Briggs to its service department. Based in Portland, Oregon, Briggs is the company’s newest smart solutions engineer.
Briggs joins Juki with seven years of experience as a Customer Engineer at Applied Materials, a semiconductor manufacturing equipment company.
“We’re excited to have Chris on board. He will really help us to continue to provide the high level of support we give our customers, especially in the Pacific Northwest,” said Carlos Eijansantos, director of sales & marketing at JAS, Inc.
Machine operation, service training and software classes are available to every Juki customer at no charge. Installation and on-site training is included with the purchase of every machine and performed by Juki’s highly experienced and motivated service organization that is truly dedicated to satisfying each and every customer.
About Juki Automation Systems, Inc.
Juki Automation Systems (JAS), is an international leader in high-speed SMT Assembly equipment, has shipped more than 40,000 machines worldwide since 1987. Juki has built its global image with a combination of top-quality and high-reliability machines with a reputation for world-class service and support that result in the lowest production costs for its customers. Juki machines have about 30 percent U.S. made content by cost. The pioneer of the modular assembly system in 1993, Juki offers flexible solutions designed for both high-volume and high mix environments. JAS, Inc. employs 45 U.S. employees, including 20 service personnel five specializing in applications sales.
Additionally, JAS, Inc. offers a full line of SMT manufacturing products as wells as selective solder and stamp soldering machines plus Advanced Technology through-hole machines. Juki supports one of the largest field service groups in the industry.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.