Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Gelest Appoints Jim Whitlock COO
April 9, 2019 | GelestEstimated reading time: 1 minute
Gelest Inc. has appointed Jim Whitlock to the newly created position of Chief Operations Officer, effective immediately, to deepen its senior leadership team in conjunction with the company’s continuing growth.
“Jim has over 30 years of experience in the silicone business, including roles as senior vice president and corporate vice president with Dow Corning in its Core Products Business and Global Manufacturing & Engineering Operations, and he is joining Gelest at a pivotal time,” said Ken Gayer, chief executive officer of Gelest. “The expansion of our senior leadership team reflects Gelest’s commitment to operational excellence and growth as a globally-recognized leading innovator and manufacturer of highly value-added advanced materials. With Jim’s appointment, we look forward to improving customer satisfaction and operational performance in every respect and accelerating our growth in advanced technology end markets with the support of our partners at New Mountain Capital.”
Whitlock joins Gelest from Honeywell, where he served as vice president of Integrated Supply Chain for their Performance Materials & Technology business Group.
“I look forward to working with my new colleagues, driving operations excellence to position the Company for profitable and sustainable growth, and positively contributing to the Company's strategic priorities. I am excited to apply my extensive experience to help the Company achieve greater results and drive value," said Whitlock.
Whitlock graduated with a Bachelor of Science Degree from The Ohio State University.
About Gelest
Gelest, Inc., headquartered in Morrisville, Pennsylvania, is an innovator, manufacturer, and supplier of silicones, organosilanes, and metal-organics for advanced technology end markets including medical device, life sciences, microelectronics, personal care, and advanced coatings, adhesives, sealants, elastomers (CASE) markets. The company helps customers win by assisting them in the development and supply of chemistry to solve their most challenging materials science problems and enable their new product technology.
About New Mountain Capital
New Mountain Capital is a New York based investment firm that emphasizes business building and growth, rather than debt, as it pursues long-term capital appreciation. The firm currently manages private equity, public equity, and credit funds with over $20 billion in assets under management. New Mountain seeks out what it believes to be the highest quality growth leaders in carefully selected industry sectors and then works intensively with management to build the value of these companies.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.