Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
ZESTRON Academy to Co-host Free Reliability of Circuit Assemblies Workshops
April 11, 2019 | ZESTRONEstimated reading time: Less than a minute
ZESTRON will co-host the Reliability of Circuit Assemblies Workshops which will begin touring in May 2019.
The workshops will feature experts from across a broad range of the circuit assemblies ecosystem discussing topics including; cleaning, conformal coating, soldering materials, failure analysis, new IPC cleanliness testing standards, and more. Speakers will include industry thought leaders from Aqueous Technologies, ZESTRON, Foresite, Specialty Coating Systems, Nordson Asymtek and FCT Solder.
The Reliability of Circuit Assemblies Workshops will be held in Rockville, MD (May 21); Raleigh, NC (May 23); Melbourne, FL (June 25); and Tampa, FL (June 27). Each event will include time for attendees to network with peers. Breakfast and lunch will be provided.
About ZESTRON
ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.