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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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ASM Presents the Integrated Smart Factory at SMTconnect 2019
April 11, 2019 | ASM Assembly SystemsEstimated reading time: 1 minute
At the SMTconnect trade show (May 7–9 in Nuremberg, hall 5, booth 311), ASM will exhibit solutions for the integrated smart factory in the areas of hardware, software and services. Highlights at the booth and the two SMT production lines being exhibited will include DEK SmartStencil, ASM Command Center, and digital learning and maintenance tools from the ASM Service team.
The central motto at the booth will be "ASM brings the integrated smart factory to life". On a central control wall, ASM will demonstrate with its new ASM Production Planner and ASM Command Center that many tasks in a modern electronics factory can be easily run from a central control point.
At two production lines (one featuring a DEK NeoHorizon printer with the ASM ProcessExpert and a SIPLACE SX placement machine, the other E by DEK and E by SIPLACE systems), ASM will present new features like the improved SIPLACE Odd-Shaped Component Package II and the new DEK Printer Programming. At the DEK NeoHorizon printer visitors can examine the new DEK SmartStencil, an RFID-based hardware and software solution for monitoring and managing stencil service cycles.
The ASM Service portfolio will focus on the digital transformation and present VR solutions for easy maintenance as well as the ASM Learning Management System for the mobile training of line staff and engineers.
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Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
Solder Printing: SMT007 Magazine—September 2024
09/03/2024 | I-Connect007 Editorial TeamIn this issue of SMT007 Magazine, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging. Join us as we look at the latest in solder printing equipment, printable solder pastes, and the opportunities they present.