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April 17: IPC Webinar on Weak Interface/Stacked Microvia Reliability
April 12, 2019 | IPCEstimated reading time: Less than a minute
For the upcoming IPC Wisdom Wednesday Webinar on April 17, the topic will be on weak interface/stacked microvia reliability concerns, to be presented by Dennis Fritz, IPC V-TSL-MVIA Co-Chair. The webinar is scheduled for 10:00–10:45 am CDT.
IPC has issued an industry warning on microvia reliability for high performance products. A number of IPC OEM member companies have presented examples of microvia failures that were not observed until after bare printed board fabrication, inspection and acceptance.
This free webinar will discuss why IPC has issued this warning and will provide an overview of this problem, with examples of the different conditions of concern. It will also cover how IPC has organized to address the problem, including sub-teams formed earlier this year at IPC APEX EXPO.
To gain a deeper understanding of this issue and how it may impact the design and testing of bare boards, register today by clicking here.
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