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Indium Expert to Present at IMAPS New England
April 16, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Tim Jensen, product manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS New England 46th Symposium & Expo, May 7, Boxboro, Massachusetts, USA.
Jensen’s presentation, Liquid Metal Innovations for High-Performance TIMs, will examine how the thermal conductivity values of metals make them highly sought after as a thermal interface material (TIM). While the hardness of metals limits their effectiveness due to high interfacial resistance, liquid metal alloys maintain the same high thermal conductivity without the limiting factors of solid alloys. His presentation will explore the methodologies and techniques that can overcome process challenges and enable liquid metal to be used in a wider array of TIM1 and TIM2 applications.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers to troubleshoot and optimize SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, and thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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