-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha Launches ALPHA HiTech Adhesives and Encapsulants
April 17, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The assembly division of MacDermid Alpha Electronics Solutions to launch the ALPHA HiTech product series of SMD adhesives, UV adhesives and encapsulants which are designed for a wide range of applications.
“We are pleased to introduce our first phase of HiTech products into the ALPHA portfolio,” said Jimmy Shu, director of marketing for Asia-Pacific. “With this new suite of products, MacDermid Alpha is well-situated to capitalize on many emerging trends in the electronics industry and offer customers additional support to solve their unique assembly challenges”.
ALPHA HiTech SMD Adhesives are one component, intermediate temperature, fast heat curable surface mount products. They are designed to hold chip components in place during the wave soldering process. Each product is formulated to optimally be used for either dispensing or printing applications.
They are well suited for wave soldering processes requiring soldering on non-through hole components such transistors, capacitors and small outline transistors (SOT). Industry segments with this process requirement are power supply, battery chargers, LED drivers, smart meters and white goods assembly.
ALPHA HiTech UV Adhesives are one component, ultraviolet curable materials which can be used to mechanically bond substrates together or encapsulate components at below 25°C. The instant curing capability of these products, within seconds under UV exposure, makes it ideal for production processes with high throughput requirements. They are formulated for applications in industry segments such as Mobile (e.g. main PCBs, wireless charger components, camera modules), computing (e.g. CD-ROM, optical pick ups) and displays (e.g. LCD TV).
ALPHA HiTech Encapsulants are one component, intermediate temperature, fast heat curable materials which are designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking. The applications include the portables such as smartphones and smartcards which require increase of mechanical reliability.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner lients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.