Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Trouble in Your Tank: Pre-electroless Causes of Voids

09/02/2026 | Michael Carano -- Column: Trouble in Your Tank
To support advanced 2.5D and 3D heterogeneous integration, product and motherboard designs are now using higher layer counts. As layer counts increase, plated through-holes (PTHs) become deeper and higher in aspect ratio, making it more difficult to achieve a continuous, void-free copper deposit. Drilling these thicker panels and higher aspect ratio vias adds another layer of complexity. Since there are many potential causes of PTH voiding, I’ll focus on pre-electroless copper causes, including drilling.

Micron Opens State-of-the-Art Training Center in Boise to Strengthen America’s Semiconductor Workforce

08/26/2026 | Micron
Micron Technology Inc., the only U.S.-based manufacturer of memory and storage solutions, opened a 60,000-square-foot Micron Training Center (MTC) in Boise, a strategic investment to strengthen the skilled talent pipeline, support advanced semiconductor manufacturing and expand education and apprenticeship pathways in Idaho.

Incap Germany Expands Soldering with SEHO SelectLine-C 500

08/18/2026 | Incap
Incap Germany has further expanded its selective soldering capabilities with the commissioning of a new SEHO SelectLine-C 500.

TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock

07/30/2026 | TopLine
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, including BGA, QFN, QFP, PLCC, TSOP, and many others.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in