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Boeing Commits to Expand South Carolina Operations

12/20/2024 | Boeing
Boeing announced it plans to expand its operations in Charleston County. The company plans to invest $1 billion in infrastructure upgrades at its existing site and create 500 new jobs over the next five years.

High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027

12/20/2024 | TrendForce
TrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.

The Effects of Copper on a Transmission Line

12/23/2024 | Todd Kolmodin, Gardien Services
As technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.

RTX's Collins Aerospace Announces Avionics Modernization Program for King Air and Hawker Aircraft

12/17/2024 | RTX
Collins Aerospace, an RTX business, has announced a comprehensive avionics upgrade and modernization program for Beechcraft King Air and Hawker aircraft, spanning Collins' Pro Line Fusion® and Pro Line 21™ advanced avionics systems.

SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
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