-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Flex and Innit Collaborate with Google Cloud
April 22, 2019 | FlexEstimated reading time: 3 minutes
Flex and Innit, in collaboration with Google Cloud, announced a solution to power smart kitchen appliances, enabling seamless connectivity, built-in security, upgradeability and interoperability “out of the box.” This pre-integrated, fully tested suite of solutions is designed for makers of appliances such as ovens, refrigerators, cook tops, smart cookers and blenders to add modern interactive controls, connect different products using Google Cloud, and utilize the Innit platform to reinvent the food preparation process and deliver restaurant-quality experiences in the comfort of home.
To power these capabilities across a variety of kitchen appliances including ovens, refrigerators, cooktops, smart cookers and blenders, the three companies designed a pre-integrated, fully tested suite of solutions for appliance manufacturers, aimed at reducing the cost of adding new connected capabilities.
Flex has introduced a new line of standardized IoT and human interface modules, backed by award-winning manufacturing services. Google Cloud contributes its leading AI, voice, security, IoT cloud connectivity services, and the new Tensor Processing Unit (TPU) artificial intelligence chips for smart devices. Innit’s platform connects devices and services into a compelling consumer experience, orchestrating multiple brands of appliances to prepare meals with personalized nutrition, step-by-step video guidance and customized, automated cooking programs tailored to each device.
“Until now, appliance manufacturers have been forced to assemble their own hardware and software components to create smart devices,” said Kevin Brown, CEO and co-founder at Innit. “The Flex-Innit-Google Cloud solution provides a powerful platform to build programmable, upgradeable appliances with differentiated features quickly and cost-effectively, with instant connectivity to the cloud and a rich network of food and technology partners.”
“This Flex-Innit-Google solution integrates hardware, software, cloud and partner ecosystems, and can enable rapid development of products that come alive with connectivity to top brands and advanced services,” said Dave Gonsiorowski, vice president of Innovation Services at Flex. “There’s a tremendous opportunity for this technology to help consumers simplify the process of cooking world-class meals at home.”
The next generation of IoT 2.0 functionality in the kitchen appliance market promises to bring much richer orchestration, including personalized settings, post-sale software-upgradeable features and interoperability of devices from different vendors with an intuitive, unified consumer experience.
“In a world of accelerating development cycles, appliance manufacturers need solutions to rapidly integrate connectivity, security, analytics, and partners so they can focus on core differentiation,” said Antony Passemard, head of product management for Cloud IoT at Google Cloud. “The Flex-Innit-Google Cloud solution enables devices to instantly connect to Google Cloud Platform and access a wide variety of services, ensuring consumers have a great experience and manufacturers can offer their customers better experiences, support and product innovation.”
In contrast to simple tasks like turning on a light bulb, smart kitchen appliances need to support sophisticated, precise actions that can be pre-programmed and adapted to a wide variety of foods, with coordination across different appliances. This new solution offers the following capabilities:
- Streamlined connectivity for IoT devices
- Enhanced end-to-end IoT security
- Cloud services and device identity management for millions of appliances
- Software-upgradeable features for purchase
- Rich content and adaptive cook programs tailored to get the most out of each device
- Orchestration of heterogeneous appliances within a multi-step cooking session
- Personalized and context-driven voice/video interactions
Availability
The joint Flex-Innit-Google Cloud solution was showcased in private demos at CES 2019 in Las Vegas to leading small and large appliance manufacturers and is available for pilot implementations.
About Flex
Flex is the Sketch-to-Scale solutions provider that designs and builds intelligent products globally. With approximately 200,000 employees across 30 countries, Flex provides innovative design, engineering, manufacturing, real-time supply chain insight and logistics services to companies of all sizes across industries and markets.
About Innit
Silicon Valley-based Innit has developed the world's first Connected Food Platform, which simplifies the entire food journey for consumers. Realizing and leading the vision of the connected kitchen, Innit is a centralized hub that integrates a disjointed food system by focusing on the way individuals want to eat. Combining the strengths of its partners' products and services with its platform, Innit provides a personalized, connected, and confidence-building consumer experience across the eating ritual.
Suggested Items
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
ASC Sunstone Circuits to Exhibit at PCB Detroit 2025
05/05/2025 | ASC SunstoneASC Sunstone Circuits will be exhibiting at the inaugural session of PCB Detroit to be held on June 2 and 3 on the campus of Wayne State University.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: DuPont Electronics Materials and Innovations
04/23/2025 | Real Time with...IPC APEX EXPODuPont is many things to many markets, but DuPont Electronics Materials is, perhaps, a bit out of the DuPont "norm," developing specialized electronic materials that are particularly focused on challenging areas such as flex circuits, high power PCBs and products that must withstand harsh environments. At IPC APEX EXPO, Marcy LaRont sat down with Shannon Dugan from DuPont Electronics Materials to discuss some big news. They are being spun off into an independent entity with a new CEO having just been announced as the show wrapped.