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Qisda Wins Certifications for Robot-based Production Lines
April 23, 2019 | DigitimesEstimated reading time: Less than a minute
EMS provider Qisda has obtained ISO 10218 and ISO/TS 15066 certifications for collaborative robot-based production lines at its automated factory in northern Taiwan from Taiwan-based Precision Machinery Research & Development Center (PMC), Digitimes reports.
According to PMC, collaborative robots play an important role in smart manufacturing, but their operation should be subject to safety of collaborative human workers. Qisda's collaborative robot-based production lines feature three layers of protection of collaborative workers: The first layer is placement of workers in outer working zones and collaborative robots in inner ones for collaboration; the second layer is use of grating sensing to slow down operation of collaborative robots when workers enter working zones of such robots; the third layer is for robotic arms to automatically stop operation once workers touch them.
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Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
SCHMID Group Wins Major Order for Wet-Process Equipment for AI & HPC Infrastructure
03/11/2026 | SCHMID GroupSCHMID Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line.
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
02/18/2026 | Anaya Vardya -- Column: Standard of ExcellenceThe future of PCB manufacturing is here. The products we’re being asked to build today would have been called “advanced” just a few years ago. What was once special is now standard, and what was once impossible is now expected. The challenge and the opportunity lie in leading the charge to the next frontier of printed circuit board design, materials, and manufacturing discipline. To build the board of the future, we need new materials, smarter methods, and a mindset of innovation anchored in flawless execution.
UHDI Fundamentals: An Overview of UHDI Layer Types
01/02/2026 | Anaya Vardya, American Standard CircuitsUHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.