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A Real Look at Today's PCB Design With Stephen Chavez

10/13/2026 | Marcy LaRont, I-Connect007
What does it take to become a better PCB designer? At PCB West, I-Connect007’s Marcy LaRont talks with Stephen Chavez of Siemens and PCEA about the practical skills engineers need beyond traditional education. Chavez explains why mastering design tools, understanding manufacturability, and involving fabrication teams early are essential to successful designs. He also discusses the value of mentorship, industry certification, and conferences, offering practical advice for engineers looking to strengthen their skills and advance their careers.

Fresh PCB Concepts: Managing PCB Trace Width and Spacing

09/22/2026 | Team NCAB -- Column: Fresh PCB Concepts
As a fabricator, I know that trace width and spacing are some of the first items reviewed when determining whether a PCB can be manufactured reliably. They may look like simple dimensions in the design data, but the ability to reproduce them consistently depends on several factors, such as the circuit's location, the copper weight used, the design density, and any additional plating requirements. These can all change what is realistically achievable.

FSQuality Circuits to Showcase Advanced PCB Manufacturing Capabilities at PCB West 2026

09/18/2026 | FSQuality Circuits
FSQuality Circuits (FQC), a leading Thailand-based manufacturer of advanced printed circuit boards, will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California.

Designers Notebook: Implementing Strategic Planning Principles for PCB Design

09/03/2026 | Vern Solberg -- Column: Designer's Notebook
Developing multiple-processor system-level products involves a broad range of engineering disciplines (commonly referred to as co-design), often led by a designated program manager who divides the development program into technical disciplines. The primary member of this team is the electrical engineer (EE), who prepares the overall schematic diagram of the product. This effort includes simulation and modeling, developing a BOM, and defining all active components and any specialized passive elements (often stipulating preferred or prequalified sources).

DFM Mistakes Designers Make When Moving to ELIC

07/20/2026 | Anaya Vardya, American Standard Circuits
The transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.
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