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Qisda Wins Certifications for Robot-based Production Lines
April 23, 2019 | DigitimesEstimated reading time: Less than a minute
EMS provider Qisda has obtained ISO 10218 and ISO/TS 15066 certifications for collaborative robot-based production lines at its automated factory in northern Taiwan from Taiwan-based Precision Machinery Research & Development Center (PMC), Digitimes reports.
According to PMC, collaborative robots play an important role in smart manufacturing, but their operation should be subject to safety of collaborative human workers. Qisda's collaborative robot-based production lines feature three layers of protection of collaborative workers: The first layer is placement of workers in outer working zones and collaborative robots in inner ones for collaboration; the second layer is use of grating sensing to slow down operation of collaborative robots when workers enter working zones of such robots; the third layer is for robotic arms to automatically stop operation once workers touch them.
Suggested Items
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs
04/08/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12, and more to only two layers. Besides reducing direct processing steps, the yield will increase as defect-producing operations are eliminated. The integrated mesh power system (IMPS) was invented in the latter years of MCM-D use for thin-film fabrication. Those geometries fit today into our use of ultra HDI.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
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Now Available: Episode 4, Season 2 of Designing for Reality—Lamination
04/04/2024 | I-Connect007I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.