-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson SELECT to Exhibit at SMTconnect 2019
April 24, 2019 | Nordson SELECTEstimated reading time: 2 minutes
Nordson SELECT, a Nordson company, will exhibit an integrated selective soldering line together with smartTec GmbH in Hall 4, Booth 101 at the upcoming SMTconnect 2019 exhibition scheduled to take place May 7-9, 2019 at the Nuremberg Messe in Nuremberg, Germany.
The exhibit will include a Nordson SELECT Integra® 508.3PD 2seg selective soldering system integrated in-line with automatic load/un-load modules and a through-hole pick-and-place insertion module with the entire process equipped with RFID technology for continuous tracking.
The Integra 508.3PD 2seg selective soldering system features dual parallel in-line processing that allows the system to solder two printed circuit boards at the same time without the need for the boards to be in a panel or palletized enabling the machine to process two boards at the same time without requiring tooling. The Integra® 508.3 is available in three different variants to meet a broad range of selective soldering requirements. The Integra® 508.3S configuration with single fluxer and solder pot allows single board processing. The Integra® 508.3PD configuration with dual fluxers and solder pots can use two solder nozzles in the same soldering station or processing two boards in a panel simultaneously. The Integra® 508.3PD 2seg configuration with dual fluxers and solder pots can solder two singulated boards in a parallel mode in-line with the conveyor.
The Integra 508.3 features Nordson SELECT’s unique automatic solder nozzle tinning system. Unlike other nozzle cleaning systems, Nordson SELECT’s patent pending system does not spray an adipic acid or a liquid or powdered flux. Two types are available and both the flux core wire and flux gel systems do an exceptional job of keeping the solder nozzles clean by removing oxidation residues and re-tinning the nozzle surface without overspray or contamination. Advanced features available on the Integra® 508.3 include a full-automated fiducial alignment and board mapping function as well as a board warpage sensing system to ensure consistent production quality.
Also on display will be the Novo® 300, an entry lvel selective soldering platform with a compact footprint requiring less than 1.1 square meters of factory floor space. The Novo® 300 is a standalone platform that is ideally suited for prototype, cell manufacturing or small batch production.
About Nordson SELECT
Nordson SELECT, is a leading worldwide supplier of selective soldering systems including Novo® standalone machines offering exceptional value and superior process capability ideal for batch production, Cerno® in-line systems delivering uncompromised quality and productivity for demanding soldering applications, and Integra® multi-station modular systems designed to meet the most challenging high-volume requirements by combining parallel processing with multiple soldering nozzles for the ultimate in flexibility and maximum throughput. To find out more, visit www.nordsonSELECT.com, or on social media.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces. These products are supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in nearly 40 countries.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.