-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium to Host Reliability Symposium at SMTA Chapter Events
April 29, 2019 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation, in cooperation with industry partners MicroCare and Weller, is kicking off a half-day, reliability-focused technical symposium roadshow at SMTA Carolinas’ Expo & Tech Forum, starting May 2 in Durham, North Carolina.
Surface Mount Technology Association (SMTA) will host a series of these technical symposiums during which partners—global leaders in their own areas of expertise—will discuss best-in-class processes.
Indium Corporation’s Kim Flanagan, technical support engineer, will present Impact of Exposing No-Clean Solder Paste Flux Residues to a Water Wash Cleaning Cycle. Her paper examines the increasing importance of electrical reliability in automotive, medical, and military or aerospace applications. In it, Flanagan reviews a series of surface insulation resistance (SIR) tests performed on no-clean flux residues that have been cleaned insufficiently and exposed to water wash processes in order to determine whether electrical reliability was affected.
Mike Jones, vice president – international, of MicroCare will explore the Reliability of Critical Cleaning and Best Practices in Electronics. His presentation examines cost-benefit trade-offs to cleaning and how cleaning can be an important tool for enhancing reliability in a production engineer’s toolbox. Cleaning adds manufacturing costs but can speed throughput, slash waste, minimize warranty expenses, extend product service lives or enable new capabilities. Balancing these options properly can enhance profitability.
Bubba Powers, manager, technical services for Weller Professional Tools – North America, will discuss the reliability of robotics for electronics manufacturing. this includes an overview of the process of automation in the soldering workplace, and a discussion of what factors are critical for high-reliability electronics in both manual and automated manufacturing environments.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the quality department. She remained with Indium Corporation as a part-time quality engineering technician while she finished her bachelor’s degree in Physics from Le Moyne College and joined the technical support team in December 2016.
Jones has specialized in the field of critical cleaning for more than 30 years. Jones helps companies update their critical cleaning processes to reduce costs, improve productivity, and boost quality while protecting the environment. These products help companies enhance their cleaning processes in industries as diverse as electronics, metal finishing, transportation, photonics, medical devices, and aerospace.
Powers has been with Weller in varying positions of leadership for almost four decades. For the past three decades, he has primarily been involved in technical and application support roles for the electronics market. He has authored several white papers and hosted webinars pertaining to industry challenges, standards, and applications. Powers served as a committee chairperson on the ESD Associations Standards team for ANSI/ESD S13.1-2015 Electrical Soldering / Desoldering Hand Tools. Powers holds a certification as an IPC 7711 / 7721 CIT Instructor. He continues to support the industry’s many challenges for automation and hand soldering applications in the marketplace.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.