Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Amerway Adds Capability with New Continuous Casting Machine
April 30, 2019 | Amerway Inc.Estimated reading time: 1 minute
Amerway Inc. has boosted its production capabilities with the installation of a new ‘Continuous Casting’ machine at the company’s Beale Avenue manufacturing facility in Altoona, Pennsylvania. The new machine, with its innovative circular ‘casting wheel’ design, speeds up production capabilities for Amerway solder bar and wire products.
In making the announcement, Terry Buck, president, said, “We’re pleased to have this new capability up and running in-house now, because it improves lead times for all orders, especially large orders. It can generate on average 2,000 lbs. an hour of alloy products, depending on the alloy, and of course that means lead-free. Its design prevents cross-contamination of alloys so that our customers not only receive their products fast and on time, but they can also be assured of its absolute purity.”
Tim Brown, Sales Manager, added that “This machine utilizes a single-cast operation, reducing the cost of manufacturing and that includes labor and press expenses. Its greater capability frees up press time for other products, and thereby reduces lead times across the board for all Amerway products.”
Amerway manufactures a large selection of lead-free alloys and metals products including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more, in Altoona, Pennsylvania, conveniently in the eastern United States, Amerway holds ISO 9001 quality certification.
About Amerway
Amerway Inc., based in Altoona, Pennsylvania, USA, is a premier supplier of solder bar, solder wire, fluxes, and custom alloy products to the electronics manufacturing industry. Amerway manufactures a large selection of lead-free alloys including pure tin, tin/copper, tin/antimony, tin/silver, SAC-alloys, fluxes, and more.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.