-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA Int'l Conference for Electronics Enabling Technologies Program Finalized
May 8, 2019 | SMTAEstimated reading time: 1 minute
SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 4-6, 2019 in Markham, Ontario, Canada.
The conference is located within the ventureLAB, IBM Markham Convergence Centre. The SMTA Ontario Expo on Wednesday, June 5, will feature companies highlighting the latest manufacturing solutions.
Four Professional Development Courses will be held on Tuesday, June 4. Two courses are scheduled for the morning: “Failure Analysis of Electronic Devices” and “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.” The other two courses are slated for the afternoon: “Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes” and “Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.”
E. Jan Vardaman, TechSearch International, Inc., will deliver the keynote presentation, “Dealing with the Challenges in the New Advanced Packaging Era” on Wednesday, June 5.
Conference sessions on June 5 and 6 will cover Solder Materials, Harsh Environment & Fiber Optics, Failure Analysis & Reliability, Components & Substrates, Ruggedization and Conformal Coating. A panel discussion on "Ruggedization - The Next Technology Wave" is organized for Thursday.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.