SMTA Int'l Conference for Electronics Enabling Technologies Program Finalized
May 8, 2019 | SMTAEstimated reading time: 1 minute
SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 4-6, 2019 in Markham, Ontario, Canada.
The conference is located within the ventureLAB, IBM Markham Convergence Centre. The SMTA Ontario Expo on Wednesday, June 5, will feature companies highlighting the latest manufacturing solutions.
Four Professional Development Courses will be held on Tuesday, June 4. Two courses are scheduled for the morning: “Failure Analysis of Electronic Devices” and “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.” The other two courses are slated for the afternoon: “Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes” and “Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.”
E. Jan Vardaman, TechSearch International, Inc., will deliver the keynote presentation, “Dealing with the Challenges in the New Advanced Packaging Era” on Wednesday, June 5.
Conference sessions on June 5 and 6 will cover Solder Materials, Harsh Environment & Fiber Optics, Failure Analysis & Reliability, Components & Substrates, Ruggedization and Conformal Coating. A panel discussion on "Ruggedization - The Next Technology Wave" is organized for Thursday.
About SMTA – A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.