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Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
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As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
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This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
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Murray Percival Partners with Cluso Vision Systems
May 9, 2019 | Murray Percival CompanyEstimated reading time: Less than a minute
Murray Percival Company partnered with Cluso Vision Systems to offer the industry’s smartest SMT reel storage system, the InvMan-S1.
The InvMan-S1 is a fully wireless, portable SMT reel storage solution. The InvMan-S1 was designed to be as flexible as possible with the ability to adjust the location width at any time to accommodate any size reel in less than 3 seconds. Storing a reel is as easy as scanning any empty location and scanning the component barcode number.
InvMan-S1 has a location on the bottom shelf where odd form components such as PCBs, bins, etc. can be stored to help create a full inventory management solution. This storage solution was designed with traceability and IS013485 in mind, giving you a fully traceable timeline for unique reel identification as well as FIFO.
About Murray Percival
Murray Percival Company is a third-generation family owned business that was founded in January of 1960, and subsequently incorporated in the state of Michigan as the Murray A. Percival Company. They are currently the leading supplier to the Midwest's electronics industry, offering thousands of capital and distribution products as well as the industry’s leading process enabler.
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Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.