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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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SMTA Releases Free BGA Defect Guide for Download
May 16, 2019 | SMTAEstimated reading time: Less than a minute
SMTA recently released the "Guide to BGA Assembly & Soldering Defects," a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.
The full-color booklet features high-quality images of both optical and X-ray examples of common and not-so-common defects affecting ball grid array (BGA) and area array components during assembly. The examples include cosmetic or electrical failures found during investigation in manufacture. Each defect type is discussed with possible causes and cures.
Thanks to the support of YXLON, the official sponsor of the defect guide, SMTA could make this resource available as a complimentary download. Association members can simply log in to download the guide, and non-members just need to complete a short registration form to get access to the electronic document.
For more information, visit https://www.smta.org/knowledge/defect-guide/.
About SMTA—A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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The Knowledge Base: A CM’s Perspective on Box Build Practices
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Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
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Determining the Value-add of Box Build
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IMAPS & IPC to Host Onshoring Workshop
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