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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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iNEMI Webinar: Visual Inspection Criteria for Expanded Beam Connectors
May 17, 2019 | iNEMIEstimated reading time: Less than a minute
Expanded beam connectors can reduce the impact of contamination on connector loss compared to fiber-based physical contact connectors due to the increased lens surface area compared to the fiber core. However, the technology does not completely eliminate these additional losses. To date, no formal inspection criteria for allowed lens defects, including contamination, have been adopted by the industry for any expanded beam connectors.
Phases 1 and 2 of iNEMI’s Development of Cleanliness Specification for Expanded Beam Connectors project developed a unique approach for visual inspection criteria for cleanliness on multimode expanded beam connectors. iNEMI is now organizing a third phase to develop visual inspection criteria for single-mode expanded beam connectors.
In line with this, iNEMI is inviting the industry to join the call-for-participation webinar to review plans and objectives for Phase 3 of this important project. Two webinar sessions are scheduled, and are open to members and non-members:
- Session 1: The Americas / Europe: May 31, 11:00 a.m. EDT (US)/17:00 CEST (Europe). Click here to register for this session.
- Session 2: Asia Pacific: June 6, 11:00 a.m. CST (China)/12:00 p.m. JST (Japan). Click here to register for this session.
Testimonial
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Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.