Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Yamaha Unveils Manufacturing Solutions at SMT Connect 2019
May 20, 2019 | Yamaha Motor Europe SMTEstimated reading time: 2 minutes
At SMT Connect 2019 in Nuremberg, Yamaha Motor Europe SMT Section revealed more details of new surface-mount equipment and software tools joining the Yamaha Total Line Solution to boost productivity and quality.
“Europe’s high-tech sector is extremely active right now and we met many visitors engaged in ongoing projects seeking solutions to specific challenges,” said Ichiro Arimoto. “We introduced important innovations throughout our Total Line Solution that are designed to overcome the challenges they are facing.”
Yamaha’s latest equipment line-up now adds the YSP10 screen printer with next-generation automated features. Seen for the first time in Europe at SMT Connect, the YSP10 eliminates human intervention from product changeovers by automatically changing the program, stencil, and support pins and recovering unused solder paste. Yamaha technical specialists showed how this advanced automation cuts changeover time from several minutes to about 70 seconds. 510mm x 510mm maximum board size tackles today’s toughest challenges such as large display-backlight panels and industrial boards.
Alongside the YSP10, Yamaha also showcased the latest in high-speed mounting with the enhanced YSM20R. Introducing 0201-chip component-placement capability, the YSM20R also delivers a 5% speed boost leveraging faster X-Y axis speeds. Further innovations include fully automated feeder and tray exchange that cut downtime during changeovers or replenishment to the bare minimum.
With the latest YSi-SP, dedicated to solder-paste inspection, Yamaha’s proven 3D vision expertise further enhances quality assurance. Advanced features include proprietary high-speed vision algorithms and selective super-high resolution to tackle challenging areas containing small or densely-spaced pads.
In addition, enhancements to the YSi-V post-placement AOI system include a full-HD LCD touch panel with enhanced navigation to maximise the combination of the YSi-V’s12Mpixel camera and exclusive image-capture technology for super-accurate inspection capability.
Visitors also discovered two new features of Yamaha’s Factory Tools 4.0 software suite. The powerful new Dashboard shows current status and historical line data with depth and clarity, while the innovative Image Viewer greatly accelerates visual analysis and troubleshooting. By simply clicking on a Dashboard item, users can call up digital images from any camera onboard the printer, mounters, SPI and AOI in each line.
Completing the enhancements presented at SMT Connect, upgrades to the YST15 intelligent component-storage system enhance job preparation with new automated features that assist program optimisation and reserve needed components in inventory.
About Yamaha SMT Section
Yamaha Surface Mount Technology (SMT) Section is a subdivision of Yamaha Motor Robotics Business Unit in Yamaha Motor Corporation. Yamaha surface mount equipment is highly acclaimed in the market for their “module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts being mounted on circuit boards.
Yamaha SMT Section has created a strong business in the surface mount industry that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system. Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, 3D solder paste inspection, 3D PCB inspection machines, flip chip hybrid placers and dispensers. This allows Yamaha SMT Section to offer a full line of machines for electric/electronic parts mounting and propose optimum production-line makeup to answer the diversifying needs of today’s manufacturers.
Yamaha SMT Section has sales and service offices in Japan, China, Southeast Asia, Europe and North America provide a truly global sales and service network that will safeguard best in class on-site sales & service support for clients.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.