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AIM to Participate at International Microwave Symposium 2019
May 20, 2019 | AIMEstimated reading time: 1 minute
AIM will highlight their full range of specialty joining materials at the International Microwave Symposium, scheduled to take place June 2-7, 2019 at the Boston Convention Center in Boston, Massachusetts. AIM will highlight its REL22 electronic solder, which is ideal for automotive microwave applications.
REL22 is an award-winning, high reliability alloy developed to address reliability and production quality issues common to similar multi-element alloys. Both internal and customer testing has proven that REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting.
AIM’s full range of specialty joining materials including indium and gold/tin solders for packaging of microwave & RF components will also be on display. In addition to standard lead free alloys AIM offers Eutectic AuSn, AuGe and indium alloy solders for microwave packaging, die attach, hermetic sealing, thermal management, and numerous other solder assembly applications.
“We are looking forward to participating at this year’s IMS event,” said Brian O’Neill, AIM’s Specialty Materials Manager. “We are anticipating a great show and countless opportunities to connect and provide support to prospective and current AIM customers in the area.”
To discover all of the products AIM’s Specialty Division offers, including gold-tin, indium and lead-free solders, visit the company at booth #1412, June 2-7.
About AIM Specialty Division
AIM manufactures and supplies solder and braze materials for the electronic, microwave, semiconductor, LED, and photonic industries. Our innovative products and technical support helps our customers to achieve the highest quality and yields in their production processes. For more information about AIM Specialty Materials, please visit www.aimspecialty.com.
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