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Indium’s Seven Liang to Speak at High-Rel and SiP Seminar
May 21, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Seven Liang, Area Technical Manager for Shenzhen, will share his technical expertise at the Manufacturing and Processes for High-Reliability and System-in-Package Applications seminar on May 24 in Huizhou, China.
Liang’s presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.
Liang provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has more than a decade of experience in surface mount technology.
The seminar will also include presentations regarding common defects analysis and testing for PCBA soldering, smart design for electronics assembly lines, and how to calculate the reliability shelf-life for electronics.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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