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DAC to Co-Locate with SEMICON West in 2020June 5, 2019 | Business Wire
Estimated reading time: 4 minutes
Laying the foundation for the future of the global electronics systems design ecosystem, SEMI and the Design Automation Conference (DAC) have announced that DAC and SEMICON West will co-locate in July, 2020 and July, 2021.
DAC’s sponsors, the Association for Computing Machinery Special Interest Group on Design Automation (ACM SIGDA) and the IEEE Council on Electronic Design Automation (IEEE CEDA), agreed to an initial two-year commitment with SEMI to co-locate DAC with SEMICON West.
SEMI, the industry association representing the global electronic product design and manufacturing supply chain, and the DAC sponsors signed a letter of intent establishing DAC as a co-located event at SEMICON West in San Francisco from 2020 through 2021. SEMI is the organizer and producer of SEMICON West as well as six additional global SEMICON conferences. DAC organizes its own technical conference and exhibit centered around electronic design and automation from chips to systems.
The co-location represents a game-changing combination of world-class technical programs and exhibitions designed to give engineering attendees a central event to network, attend technical sessions and get exposed to the latest vendor technologies from the entire design and manufacturing ecosystem.
“It’s a pleasure to announce that DAC, noted for more than 55 years for its technical excellence in design automation, will be co-located with SEMICON West,” said David Anderson, president of SEMI Americas. “With DAC co-located with SEMICON West, the link between electronic system and semiconductor design community and the electronic product manufacturing supply chain will become even stronger.”
“Co-location is mutually beneficial for both DAC and SEMICON West, providing our customers with a centralized location that enables them to gain broader exposure and expand connections across the entire design and manufacturing ecosystem,” said Nimish Modi, senior vice president, marketing & business development at Cadence.
“We are excited to see two major industry events collocating in San Francisco. It’s a win-win situation for our customers, SEMICON West and DAC. The collocated event will provide our customers access to a comprehensive range of design and manufacturing technologies. In addition, DAC will bring a brand-new audience to SEMICON West while DAC attendees and exhibitors will benefit from the additional executive management exposure of industry leaders that attend SEMICON West every year,” said Anne Cirkel, senior director of technology marketing for Mentor, a Siemens business.
“This is great news for our customers. The colocation of these events will provide our customers with access to all the leaders across the entire design and manufacturing supply chain and ecosystem at a single location and time, and it will create a broader and richer experience,” said Dave DeMaria, corporate vice president of marketing, Synopsys.
“DAC has been the premier conference in design and design automation industry for last 56 years. With this co-location, DAC continues to fulfill its mission of providing best values on system and chip designs in the full eco system to academic and industry attendees, and we look forward in IEEE CEDA to have a strong cooperation with SEMICON West in the next two years”, said David Atienza, president of IEEE CEDA.
“DAC looks forward to exploring our synergies over the next two years where electronic design and automation meets electronics manufacturing,” said Sharon Hu, ACM SIGDA chair.
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its exhibition and suite area with approximately 200 of the leading and emerging EDA, silicon, intellectual property (IP) and design services providers. The conference is sponsored by the Association for Computing Machinery (ACM), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM's Special Interest Group on Design Automation (ACM SIGDA).
SEMI connects more than 2,100-member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.
ViTrox, which aims to be the world’s most trusted technology company, is thrilled to announce its return to IPC APEX 2024, the largest electronics manufacturing event in North America. ViTrox eagerly invites visitors to explore our offerings at Booth #2642, Anaheim Convention Center, LA, from April 9th to 11th. During this time, we will unveil a series of cutting-edge inspection solutions poised to revolutionize manufacturing production lines.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for 'Advanced Packaging' Technologies02/29/2024 | IPC
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
MKS Instruments, Inc., a global provider of technologies that transform our world, recently received the 2023 Outstanding Service Award from MFLEX, a global leader in flexible printed circuit board manufacturing and assembly. The award recognizes MKS for outstanding customer support and system service in high-production manufacturing environments.
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced a series of updates covering its repurchase plan, repeat customer success, and an R&D milestone.
You have an excellent idea for a new standard in the electronics manufacturing industry. How do you turn that idea into a reality? It’s simple: You submit a PIN to the TAEC. Now, what does that even mean? To develop a new standard, you need the help of the IPC Technical Activities Executive Committee (TAEC) Global. Ideas for new IPC standards are submitted via Project Identification Notification (PIN) to TAEC Global, which conducts an initial review. The PIN is then sent to the general TAEC standards development oversight committee for review and approval. Now, how do they review it and who comprises the committee?