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MacDermid Alpha Assembly Division to Present at Hilpert Electronics Seminar
June 7, 2019 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present its latest low-temperature soldering technologies at the upcoming `Paste Printing 4.0‘ customer technical seminar hosted by Hilpert Electronics, Alpha distributor for Switzerland, on Wednesday, 19 June 2019.
Alan Plant, Customer Technical Service Coordinator, Europe for the Assembly Division of MacDermid Alpha, will present the latest Alpha low-temperature solutions at the event, including the revolutionary Alpha OM-550 HRL1 low-temperature solder paste. "Alpha OM-550 low temperature chemistry paired with the Alpha HRL1 alloy, enables a vast improvement in drop shock and thermal cycling performance and mechanical reliability versus existing low temperature alloys," said Plant. "Furthermore, with a minimum peak temperature of only 185ºC vs 245ºC, Alpha OM-550 HRL1 solder paste reduces energy consumption in the SMT process leading to a significant reduction in energy costs. The paste also delivers an increase in production yield and a reduction in component warpage."
The seminar will also include presentations on how to achieve a cost reduction in SMT soldering by selecting the optimal soldering materials, as well as live machine demos. For more information on the Paste Printing 4.0 seminar and to register for the event please visit the Hilpert Electronics website.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic
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