Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Sono-Tek Promotes Chris Cichetti to VP of Applications Engineering
June 10, 2019 | Sono-Tek CorporationEstimated reading time: 1 minute
Sono-Tek Corporation has promoted Chris Cichetti to vice president, applications engineering. Cichetti has been invaluable in shaping Sono-Tek’s application engineering team since its inception in 2008.
Starting as an application engineer for Sono-Tek’s Electronics and Advanced Energy division in 2008, Cichetti was appointed Senior Applications Engineer in 2010, and he became Applications Engineering Manager in 2016. Under his supervision, Sono-Tek’s Application Engineering team has grown to include four full time application engineers and an Applications Specialist Lab Manager, as well as various interns and support personnel.
“Chris’ group offers customers access to decades of accumulated process knowledge and ultrasonic coating expertise, providing a strong bridge between the sales and engineering teams at Sono-Tek,” said Steve Harshbarger, Sono-Tek’s president. “This enables a very streamlined and highly intelligent process for providing unique coating solutions that are tailored to each of our customers’ needs. With a proven track record of expanding the ultrasonic technology into several new markets and applications, Chris is extremely well suited to his new role as VP of Applications Engineering.”
Sono-Tek has been a world leader in ultrasonic coating equipment solutions since 1975. The company’s application engineers work closely with customers to specify the correct equipment from the very beginning, with the option of in-house laboratory testing to leverage process knowledge to optimize coating processes. This unparalleled level of support prior to installation means that every Sono-Tek ultrasonic coating system will perform as needed when installed.
About Sono-Tek Corporation
Sono-Tek is the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems. Compared to conventional pressure spraying methods, the company’s ultrasonic nozzles do not clog, reduce liquid usage, waste, and environmental impact while achieving much more precise, uniform, thin film coatings. Sono-Tek is continually developing new applications for its unique technology, replacing wasteful practices in a world that is growing ever more environmentally sensitive. For more information, visit the company at www.sono-tek.com.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).