Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Sono-Tek Promotes Chris Cichetti to VP of Applications Engineering
June 10, 2019 | Sono-Tek CorporationEstimated reading time: 1 minute
Sono-Tek Corporation has promoted Chris Cichetti to vice president, applications engineering. Cichetti has been invaluable in shaping Sono-Tek’s application engineering team since its inception in 2008.
Starting as an application engineer for Sono-Tek’s Electronics and Advanced Energy division in 2008, Cichetti was appointed Senior Applications Engineer in 2010, and he became Applications Engineering Manager in 2016. Under his supervision, Sono-Tek’s Application Engineering team has grown to include four full time application engineers and an Applications Specialist Lab Manager, as well as various interns and support personnel.
“Chris’ group offers customers access to decades of accumulated process knowledge and ultrasonic coating expertise, providing a strong bridge between the sales and engineering teams at Sono-Tek,” said Steve Harshbarger, Sono-Tek’s president. “This enables a very streamlined and highly intelligent process for providing unique coating solutions that are tailored to each of our customers’ needs. With a proven track record of expanding the ultrasonic technology into several new markets and applications, Chris is extremely well suited to his new role as VP of Applications Engineering.”
Sono-Tek has been a world leader in ultrasonic coating equipment solutions since 1975. The company’s application engineers work closely with customers to specify the correct equipment from the very beginning, with the option of in-house laboratory testing to leverage process knowledge to optimize coating processes. This unparalleled level of support prior to installation means that every Sono-Tek ultrasonic coating system will perform as needed when installed.
About Sono-Tek Corporation
Sono-Tek is the world leader in the development and application of liquid ultrasonic atomization technology into nozzle systems and spraying and coating application systems. Compared to conventional pressure spraying methods, the company’s ultrasonic nozzles do not clog, reduce liquid usage, waste, and environmental impact while achieving much more precise, uniform, thin film coatings. Sono-Tek is continually developing new applications for its unique technology, replacing wasteful practices in a world that is growing ever more environmentally sensitive. For more information, visit the company at www.sono-tek.com.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.