-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Brewer Science Expands Printed Electronics Capabilities
June 12, 2019 | Brewer ScienceEstimated reading time: 2 minutes
Brewer Science, Inc. (BSI) has announced the expansion of its printed electronics program to incorporate service capabilities. These new services are categorized into three major core competencies: printing, electronics and software. The new offerings will enable customers to take full advantage of BSI’s core competencies and expertise in printed electronics sensor systems for a variety of applications.
Printing Services
BSI has a wide range of printing capabilities for flexible-hybrid electronics (FHE) and other printing needs. Its state-of-the-art equipment can accommodate both screen printing and spray coating. Additionally, the company can provide multilayer, front and back printing services with optical layer alignment for a variety of substrates and inks.
Electronics Services
As the FHE market grows and enables unique applications, the ability to produce these electronic components can be challenging. BSI has partnered with customers to provide solutions for both FHE and traditional printed circuit boards (PCBs). These turn-key, integrated FHE solutions services include flexible circuit board design, lay out, manufacturing, communications, firmware, and population; laser cutting and engraving; data transport and storage; device testing and consulting.
Software and Other Services
Since Brewer Science was founded in 1981, it has focused on developing and delivering the finest services and materials in the semiconductor industry. Having excelled in this capacity for nearly four decades, BSI has developed a large number of ancillary capabilities that, while world-class, have previously been solely focused on internal use. As of today, these capabilities are now available to customers, and include computer-aided design (CAD) schematics capture, PCB layout, laser cutting and engraving, and data transport and analysis.
“As a company, we’ve built much of our strength and reputation on innovation,” said Dan Brewer, Executive Director of Emerging Technology at Brewer Science. “Printed electronics is the latest arena in which we are applying our innovation leadership to greatly impact where technology is going and how it can benefit people from all walks of life.”
Sensors Expo
Brewer Science will be exhibiting and presenting at the Sensors Expo and Conference in San Jose, Calif., from June 25-27, 2019. Visit Booth 1422 at the San Jose Convention Center to learn more about these new printed electronics service capabilities. Additionally, BSI will host a free afternoon workshop at 1:00 p.m. on June 26 with other industry leaders focusing on ‘Next Generation Sensing: Printed Sensors.’ The presenters will delve into the current state of the printed sensors market, where it’s heading, and which applications will be the next to adopt this exciting technology.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/15/2026 | Nolan Johnson, I-Connect007When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.
Incap India Invests in Testing and SMT Upgrades to Scale Production
05/15/2026 | IncapIncap India has completed the installation of a new flying probe test system and a full SMT (Surface-Mount Technology) line upgrade at its Tumkur factory.
Interlink Electronics Reports Q1 2026 Results
05/15/2026 | Globe NewswireRevenue for the first quarter of 2026 increased 15% to $3.07 million, compared to $2.66 million in the first quarter of 2025. The increase was driven by higher shipments of the Company’s force-sensing and printed electronics products, partially offset by lower sales of its gas‑sensor products.
New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability
05/14/2026 | I-Connect007I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.
Nortech Systems Reports Q1 Results
05/14/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical imaging, medical device, industrial, and aerospace & defense markets, reported financial results for the first quarter ended March 31, 2026.