-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
June 13, 2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STIEstimated reading time: 12 minutes
The IC data is interesting but does not have enough of a sample size to draw any firm conclusions. What is clear from the data is that the solubility of all of the WOAs is not linear with IPA concentration for this particular solder flux. It appears that, for the flux studied, there is an optimum IPA concentration, which may be located around 50% IPA 50% DI water. This indicates that the commonly used 75% IPA 25% DI water system may not be optimal.
Further Work
The findings of this study are interesting and warrant further investigation. To better refine the gravimetric data for the WOAs understudy a complimentary solubility determination method will be used. Top contenders for this method are titrations, ultraviolet-visible spectroscopy (UV-VIS), laser solubility determination, or a synthetic method [16 & 17]. These methods have the potential for being much more sensitive than the gravimetric method. The UV-VIS method is currently being explored. In addition to additional experimental work for the solubility of WOA in mixed solvent systems, a theoretical approach using Hansen Solubility Parameters is being undertaken [18]. In addition to improving the data as a function of IPA concentration, the temperature dependence of the solubility is of critical importance.
The IC work is being continued as well. Currently, additional IC samples are being run at Laboratory B. This work will be updated and expanded to additional fluxes. The specific flux used is suspected to be a substantial factor in the amount of extractable WOA ions.
References
1. Lee, N.-C. “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip-Chip Technologies,” Lee, N.-C. B. T.-R. S. P., (Ed.) Newnes, 2002.
2. Sigma-Aldrich. “Abietic acid,” https://www.sigmaaldrich.com/catalog/product/sial/00010?lang=en®ion=US.
3. Nyren, V.; Back, E. “The Ionization Constant, Solubility Product, and Solubility of Abietic and Dehydroabietic Acid,” Förlagsföreningen Acta Chemica Scandinavica, 12, pp. 1516–1520, 1958.
4. Lide, D. R. CRC Handbook of Chemistry and Physics, CRC Press, 2005.
5. Armarego, W. L. F.; Chai, C. L. L. Purification of Laboratory Chemicals: Sixth Edition; Armarego, W. L. F., Chai, C. L. L. B. T.-P. of L. C. (Eds.), Butterworth-Heinemann, 2009.
6. IPC-TM-650 2.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method. IPC 2004.
7. Zhou, Y.; Turbini, L. J.; Ramjattan, D.; Christian, B.; Pritzker, M. “Characterizing Corrosion Effects of Weak Organic Acids Using a Modified Bono Test,” Journal of Electronic Materials, 42 (12), pp. 3609–3619, 2013.
8. Verdingovas, V.; Jellesen, M. S.; Ambat, R. “Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems,” Journal of Electronic Materials, 44 (4), pp. 1116–1127, 2015.
9. ResearchGate. “Evaluating the Efficacy of a Group of Nontraditional Plasticizers on the Glass Transition Temperature of Ethyl Cellulose Polymer,” https://www.researchgate.net/Example-of-dicarboxylic-acids_tbl1_47413566.
10. Lehman, J. W. Operational Organic Chemistry: First Edition, Prentice-Hall, 2002.
11. Harris, D. C. Quantitative Chemical Analysis: Seventh Edition, W. H. Freeman and Company, 2007.
12. Nong, W.; Chen, X.; Wang, L.; Liang, J.; Wang, H.; Huang, Y.; Tong, Z. “Measurement and Correlation of Solubility of Abietic Acid in Ethanol + Water Mixtures,” Journal of Chemical Thermodynamics, 68, pp. 199–204, 2014.
13. Nong, W.; Chen, X.; Wang, L.; Liang, J.; Wang, H.; Long, L.; Huang, Y.; Tong, Z. “Measurement and Correlation of Solid-Liquid Equilibrium for Abietic Acid + Alcohol Systems at Atmospheric Pressure,” Fluid Phase Equilibria, 367, pp. 74–78, 2014.
14. Royal Society of Chemistry. “The Merck Index Online,” 2013.
15. National Center for Biotechnology Information. “Succinic Acid CID=1110,” https://pubchem.ncbi.nlm.nih.gov/compound/1110.
16. Jouyban, A.; A. Fakhree, M. A. “Experimental and Computational Methods Pertaining to Drug Solubility, Toxicity, and Drug Testing,” InTech, 2012.
17. Yi, Y.; Hatziavramidis, D.; Myerson, A. S.; Waldo, M.; Beylin, V. G.; Mustakis, J. “Development of a Small-Scale Automated Solubility Measurement Apparatus,” Industrial & Chemical Engineering Research, 44 (15), pp. 5427–5433, 2005.
18. Hansen, C. M. Hansen Solubility Parameters: A User’s Handbook: Second Edition, CRC Press, 2007.
Editor's Note: This technical paper was originally published in the proceedings of SMTA International, 2018.
Page 3 of 3Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.