SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
June 13, 2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STIEstimated reading time: 12 minutes
The IC data is interesting but does not have enough of a sample size to draw any firm conclusions. What is clear from the data is that the solubility of all of the WOAs is not linear with IPA concentration for this particular solder flux. It appears that, for the flux studied, there is an optimum IPA concentration, which may be located around 50% IPA 50% DI water. This indicates that the commonly used 75% IPA 25% DI water system may not be optimal.
Further Work
The findings of this study are interesting and warrant further investigation. To better refine the gravimetric data for the WOAs understudy a complimentary solubility determination method will be used. Top contenders for this method are titrations, ultraviolet-visible spectroscopy (UV-VIS), laser solubility determination, or a synthetic method [16 & 17]. These methods have the potential for being much more sensitive than the gravimetric method. The UV-VIS method is currently being explored. In addition to additional experimental work for the solubility of WOA in mixed solvent systems, a theoretical approach using Hansen Solubility Parameters is being undertaken [18]. In addition to improving the data as a function of IPA concentration, the temperature dependence of the solubility is of critical importance.
The IC work is being continued as well. Currently, additional IC samples are being run at Laboratory B. This work will be updated and expanded to additional fluxes. The specific flux used is suspected to be a substantial factor in the amount of extractable WOA ions.
References
1. Lee, N.-C. “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip-Chip Technologies,” Lee, N.-C. B. T.-R. S. P., (Ed.) Newnes, 2002.
2. Sigma-Aldrich. “Abietic acid,” https://www.sigmaaldrich.com/catalog/product/sial/00010?lang=en®ion=US.
3. Nyren, V.; Back, E. “The Ionization Constant, Solubility Product, and Solubility of Abietic and Dehydroabietic Acid,” Förlagsföreningen Acta Chemica Scandinavica, 12, pp. 1516–1520, 1958.
4. Lide, D. R. CRC Handbook of Chemistry and Physics, CRC Press, 2005.
5. Armarego, W. L. F.; Chai, C. L. L. Purification of Laboratory Chemicals: Sixth Edition; Armarego, W. L. F., Chai, C. L. L. B. T.-P. of L. C. (Eds.), Butterworth-Heinemann, 2009.
6. IPC-TM-650 2.3.28 Ionic Analysis of Circuit Boards, Ion Chromatography Method. IPC 2004.
7. Zhou, Y.; Turbini, L. J.; Ramjattan, D.; Christian, B.; Pritzker, M. “Characterizing Corrosion Effects of Weak Organic Acids Using a Modified Bono Test,” Journal of Electronic Materials, 42 (12), pp. 3609–3619, 2013.
8. Verdingovas, V.; Jellesen, M. S.; Ambat, R. “Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems,” Journal of Electronic Materials, 44 (4), pp. 1116–1127, 2015.
9. ResearchGate. “Evaluating the Efficacy of a Group of Nontraditional Plasticizers on the Glass Transition Temperature of Ethyl Cellulose Polymer,” https://www.researchgate.net/Example-of-dicarboxylic-acids_tbl1_47413566.
10. Lehman, J. W. Operational Organic Chemistry: First Edition, Prentice-Hall, 2002.
11. Harris, D. C. Quantitative Chemical Analysis: Seventh Edition, W. H. Freeman and Company, 2007.
12. Nong, W.; Chen, X.; Wang, L.; Liang, J.; Wang, H.; Huang, Y.; Tong, Z. “Measurement and Correlation of Solubility of Abietic Acid in Ethanol + Water Mixtures,” Journal of Chemical Thermodynamics, 68, pp. 199–204, 2014.
13. Nong, W.; Chen, X.; Wang, L.; Liang, J.; Wang, H.; Long, L.; Huang, Y.; Tong, Z. “Measurement and Correlation of Solid-Liquid Equilibrium for Abietic Acid + Alcohol Systems at Atmospheric Pressure,” Fluid Phase Equilibria, 367, pp. 74–78, 2014.
14. Royal Society of Chemistry. “The Merck Index Online,” 2013.
15. National Center for Biotechnology Information. “Succinic Acid CID=1110,” https://pubchem.ncbi.nlm.nih.gov/compound/1110.
16. Jouyban, A.; A. Fakhree, M. A. “Experimental and Computational Methods Pertaining to Drug Solubility, Toxicity, and Drug Testing,” InTech, 2012.
17. Yi, Y.; Hatziavramidis, D.; Myerson, A. S.; Waldo, M.; Beylin, V. G.; Mustakis, J. “Development of a Small-Scale Automated Solubility Measurement Apparatus,” Industrial & Chemical Engineering Research, 44 (15), pp. 5427–5433, 2005.
18. Hansen, C. M. Hansen Solubility Parameters: A User’s Handbook: Second Edition, CRC Press, 2007.
Editor's Note: This technical paper was originally published in the proceedings of SMTA International, 2018.
Page 3 of 3Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.