Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Indium Expert to Present at HiTEN 2019
June 13, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Bernard Leavitt, Senior Product Specialist, High-Temperature Engineered Solders, will present at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom.
Leavitt will present The Impact of AuSn Preforms’ Thickness on Solder Joint Reliability, which discusses how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technque utilized to counteract this challenge is the application of a thinner 80Au20Sn solder joint for die-attach to aid in thermal transfer to the copper heat sinks. Leavitt will review the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications.
Leavitt is responsible for marketing Indium Corporation’s product line for high-temperature applications. He helps customers who are looking for high-temperature soldering solutions to identify the right products for their assembly needs. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College. He’s scheduled to complete his Master of Business Administration in Business Management from Empire State in 2020.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).