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Advanced Electronics Packaging Digest

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Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

STMicroelectronics, NUS launch Corporate Lab to power the future of Edge AI in Singapore

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Chandigarh University Engineers Develop Solar-Powered Waste Management Robot

08/21/2026 | PRNewswire
In a bid to addresses the challenges of labour-intensive garbage collection and segregation, a team of Chandigarh University (CU) researchers has conceived and patented a solar-powered mobile robotic garbage collection system for automatic segregation and disposal of the garbage.

Micron Unveils U.S. Research Lab for Memory and AI Innovation

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Micron Technology, Inc. unveiled Micron Research Labs, a U.S.-based long-horizon premier research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade.
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