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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Compeq Remains Positive About Any-layer HDI PCB Demand
June 14, 2019 | DigitimesEstimated reading time: 1 minute
Compeq Manufacturing remains focused on growing its business in the any-layer HDI PCB segment, despite unfavorable global trade conditions that may deter customer demand, according to Digitimes.
Any-layer HDI PCB demand remains promising for smartphones, said Compeq chairman Wu Chien at a recent shareholders meeting. Despite uncertainty arising from the US-China trade disputes and the US ban on Huawei, the adoption of any-layer PCBs among smartphones continues to grow making a positive contribution to Compeq's sales thus far in 2019.
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OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
03/31/2026 | Happy Holden -- Column: Happy’s Tech TalkMultilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
SCHMID Group Wins Major Order for Wet-Process Equipment for AI & HPC Infrastructure
03/11/2026 | SCHMID GroupSCHMID Group, a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a major Asian high-end PCB manufacturer for a new HDI multilayer production line.
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
02/18/2026 | Anaya Vardya -- Column: Standard of ExcellenceThe future of PCB manufacturing is here. The products we’re being asked to build today would have been called “advanced” just a few years ago. What was once special is now standard, and what was once impossible is now expected. The challenge and the opportunity lie in leading the charge to the next frontier of printed circuit board design, materials, and manufacturing discipline. To build the board of the future, we need new materials, smarter methods, and a mindset of innovation anchored in flawless execution.