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Indium to Feature AuSn Solder Preforms at HiTEN 2019
June 20, 2019 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom.
Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings.
Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making them compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs. The Gold Preform Quick Turn Program offers engineering support from design to production and a quick turnaround for new design, tool, or prototype quantities.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
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