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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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FPCB Makers See Mini LED, COF as New Niche Application Segments
June 20, 2019 | DigitimesEstimated reading time: 1 minute
Taiwan makers of flexible PCBs are gearing up to develop niche board products for mini LED and COF (chip on film) applications, which are expected to become their new growth drivers next to handsets, IoT devices and antennas, Digitimes reported.
Among the makers, Zhen Ding Technology (ZDT) has successfully developed COF substrates and is expected to complete product validations at clients and start small-volume shipments by the end of 2019.
Another major FPCB maker, Flexium Interconnect, is moving to develop mini LED control modules, and upstream material supplier Taiflex Scientific also chooses to venture into the mini LED market with cover layers needed for mini LED substrates.
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Resilience Through Adaptation: What to Expect from the Electronics Industry in 2026
01/22/2026 | John Mitchell, Global Electronics AssociationWhat does the future hold for the global electronics industry? Few organizations are better positioned to answer that question than the Global Electronics Association. With a unique, global perspective spanning the electronics supply chain, we work at the intersection of industry, policy, technology, and workforce development by engaging with member companies, governments, and partners across major regions worldwide.
On the Line With… Releases Episode 11: Beyond UHDI—The Future of PCB Technology
12/10/2025 | I-Connect007I-Connect007 is pleased to announce the release of Episode 11 of On the Line With… American Standard Circuits: Ultra HDI. In this episode, host Nolan Johnson continues his conversation with ASC’s John Johnson, turning the spotlight toward the next decade of PCB innovation and what lies beyond today’s breakthroughs in Ultra High Density Interconnect (UHDI).
Ecolab to Acquire Ovivo’s Electronics Ultra-Pure Water Business
08/15/2025 | EcolabEcolab Inc. has entered into a definitive agreement to acquire Ovivo’s Electronics business, a leading and fast-growing global provider of breakthrough ultra-pure water technologies for semiconductor manufacturing.
Amidst U.S. Strategy Shift, Foxconn Sells Lordstown, Ohio Plant for $88 Million
08/07/2025 | I-Connect007 Editorial TeamAs part of a strategic shift in its US operations, Taiwan-based Foxconn (Hon Hai Precision Industry’s) subsidiaries are selling off assets at its Lordstown, Ohio, facility, the company announced on Aug. 4.
VDMA Forecast 2025: German Robotics and Automation Faces 10% Revenue Drop Investment Restraint Shapes the Outlook
06/02/2025 | VDMAThe robotics and automation industry in Germany is expected to generate total sales of €14.5 billion in 2025. This is a drop of ten percent compared to the previous year.