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IPC APEX EXPO Makes Top 25 List of Fastest-growing Shows
June 20, 2019 | IPCEstimated reading time: 1 minute
IPC – Association Connecting Electronics Industries announces that IPC APEX EXPO has been recognized by the Trade Show News Network (TSNN) as one of the top 25 fastest-growing trade shows in attendance in the United States. In addition to IPC APEX EXPO, the additional winners were recognized for their overall attendance growth from 2016 to 2018 and include a diverse mix of industries, including amusement parks, baseball and boat-builders.
According to the Center for Exhibition Industry Research (CEIR), there are approximately 13,000 trade shows held annually in the United States each year. “For the nineteenth consecutive year, IPC APEX EXPO has been recognized by TSNN as a top U.S. trade show. In the past several years, IPC APEX EXPO has seen both attendance growth and overall net-square footage growth,” said Alicia Balonek, IPC senior director of trade shows and events. “Being ranked a top trade show out of 13,000 is a tremendous accomplishment for IPC APEX EXPO and for IPC."
IPC APEX EXPO 2019 drew 5,292 attendees from 56 countries. The 440 exhibitors welcomed a busy three days of business development and qualified sales leads on 150,400 net square feet of show floor space. IPC APEX EXPO attracted 9,796 total visitors including attendees and exhibitor personnel.
IPC APEX EXPO 2020 will take place February 1–6, 2020, at the San Diego Convention Center. Companies interested in exhibiting should visit www.IPCAPEXEXPO.org.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.