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Panasonic APC-MFB Certifies TRI's TR7700QE HAPs AOI
June 24, 2019 | TRIEstimated reading time: Less than a minute
Test Research Inc.'s (TRI) TR7700QE HAPs AOI has conformed to the evaluation standards set by the required specifications for APC-MFB-Compatible AOI. This marks the second APC-MFB certification for TRI's AOI Systems, preceded by the TR7700E SIII HAP.
Featuring high-speed imaging, TRI's 3D AOI innovations help achieve zero escapes and zero false calls. The TR7700QE is able to inspect in minutes with TRI's New Smart Inspection Library, simplifying the programming and reduce fine tuning time.
TRI's PCBA test and inspection solutions work together with Industry 4.0 data management infrastructure, providing users with maximum value in the production line and minimizing production costs. Moreover, TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
About TRI
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. from solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated x-ray inspection (AXI) systems to manufacturing defect analyzers (MDA), in-circuit test (ICT) and functional test (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.