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Panasonic APC-MFB Certifies TRI's TR7700QE HAPs AOI
June 24, 2019 | TRIEstimated reading time: Less than a minute
Test Research Inc.'s (TRI) TR7700QE HAPs AOI has conformed to the evaluation standards set by the required specifications for APC-MFB-Compatible AOI. This marks the second APC-MFB certification for TRI's AOI Systems, preceded by the TR7700E SIII HAP.
Featuring high-speed imaging, TRI's 3D AOI innovations help achieve zero escapes and zero false calls. The TR7700QE is able to inspect in minutes with TRI's New Smart Inspection Library, simplifying the programming and reduce fine tuning time.
TRI's PCBA test and inspection solutions work together with Industry 4.0 data management infrastructure, providing users with maximum value in the production line and minimizing production costs. Moreover, TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
About TRI
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. from solder paste inspection (SPI), automated optical inspection (AOI), and 3D automated x-ray inspection (AXI) systems to manufacturing defect analyzers (MDA), in-circuit test (ICT) and functional test (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.