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Taiwan PCB Makers' Relocation to Southeast Asia Barely Feasible
June 24, 2019 | DigitimesEstimated reading time: Less than a minute
The feasibility of Taiwan's PCB makers relocating production from China to Southeast Asia or elsewhere along with major downstream assemblers of electronics devices is quite low, Digitimes reported.
This is contrary to reports that PCB makers are mulling following in the footsteps of downstream assemblers such as Foxconn, Pegatron, Wistron, Quanta and Compal, which have reportedly been asked by Apple to assess the possibility of moving production out of China to mitigate the impacts of the US-China trade war.
Most PCB makers dismissed such reports, stressing that whatever decisions the ODMs may make in response to the Apple request, chances are extremely slim for PCB makers to move production from China, Digitimes added.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference
06/16/2025 | Pete Starkey, I-Connect007It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.
Global Citizenship: Cultivating Cross-border Partnerships With Integrity
06/11/2025 | Tom Yang -- Column: Global CitizenshipWith rising geopolitical pressures, cross-border partnerships are essential for businesses looking to expand their reach, enhance innovation, and drive sustainable growth. However, these partnerships thrive only when founded on trust and transparency. Otherwise, even the most promising collaborations can quickly unravel, leading to financial losses and reputation damage.
Enough Talk—Time to Strengthen America’s Microelectronics Industrial Base
06/09/2025 | James Will, USPAEThe U.S. doesn’t have an innovation problem in terms of microelectronics, or a talent problem or even an investment problem. What the U.S. has is a coordination problem, and that’s threatening the livelihood of our domestic microelectronics ecosystem.