-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Orange Co. Designers Council Meeting July 18
July 3, 2019 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a “Lunch ‘n’ Learn” meeting on July 18 at JT Schmid’s Restaurant & Brewery in Anaheim.
The special guest speaker will be Julie Ellis, field application engineer with TTM. Julie will present “How Fabrication Processes Determine DFM Guidelines: A detailed look at fabrication realities to help you understand capabilities and trade-offs.”
PCB designers struggle with many challenges when planning a layout, as many factors in the fabrication process must be considered. Board shops must constantly invest in equipment and process technologies to improve their manufacturing yields as complexity grows.
Julie’s presentation will help attendees design a better PCB through a deeper understanding of major processes demonstrated in PCB101. For example, design rules are different for mechanically drilled vs. laser drilled holes, and using laser drill pad diameters for through-hole requirements may kill your project in production.
Julie will define key fabricator concerns caused by the interplay between material and process tolerances and how they stack up. The end results are minimum DFM guidelines that will generate the highest yields at the fabricator. Each fabricator’s site guidelines are established based on their unique equipment sets. The equipment sets are selected to support different technologies ranging from heavy Cu to microBGA designs.
At the end of this presentation, attendees will understand why different fab facilities have different capabilities, as well as how to identify and apply the correct design guidelines related to registration, aspect ratio and annular ring for mechanical through-hole vs. microvia blind hole, etching, plated layer vs. non-plated layer finished Cu thickness, and VIPPO (via-in-pad, plated over).
Location
JT Schmid’s Restaurant & Brewery, in the Reagan Room
2610 E. Katella Ave.
Anaheim, California 92806
(Across from the Honda Center)
Cost
The cost to attend this “Lunch ‘n’ Learn” event is $15 at the door. We are pleased to have Altium’s sponsorship to help us with the cost of the luncheon. Please RSVP no later than noon on Wednesday, July 17, so we can get a good headcount.
There are two ways to RSVP:
- Click here to RSVP
- Or email your RSVP
Thank you!
Scott McCurdy
President, IPC Designers Council, Orange County Chapter
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.