-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Orange Co. Designers Council Meeting July 18
July 3, 2019 | Scott McCurdy, Freedom CAD ServicesEstimated reading time: 1 minute
The Orange County Chapter of the IPC Designers Council will hold a “Lunch ‘n’ Learn” meeting on July 18 at JT Schmid’s Restaurant & Brewery in Anaheim.
The special guest speaker will be Julie Ellis, field application engineer with TTM. Julie will present “How Fabrication Processes Determine DFM Guidelines: A detailed look at fabrication realities to help you understand capabilities and trade-offs.”
PCB designers struggle with many challenges when planning a layout, as many factors in the fabrication process must be considered. Board shops must constantly invest in equipment and process technologies to improve their manufacturing yields as complexity grows.
Julie’s presentation will help attendees design a better PCB through a deeper understanding of major processes demonstrated in PCB101. For example, design rules are different for mechanically drilled vs. laser drilled holes, and using laser drill pad diameters for through-hole requirements may kill your project in production.
Julie will define key fabricator concerns caused by the interplay between material and process tolerances and how they stack up. The end results are minimum DFM guidelines that will generate the highest yields at the fabricator. Each fabricator’s site guidelines are established based on their unique equipment sets. The equipment sets are selected to support different technologies ranging from heavy Cu to microBGA designs.
At the end of this presentation, attendees will understand why different fab facilities have different capabilities, as well as how to identify and apply the correct design guidelines related to registration, aspect ratio and annular ring for mechanical through-hole vs. microvia blind hole, etching, plated layer vs. non-plated layer finished Cu thickness, and VIPPO (via-in-pad, plated over).
Location
JT Schmid’s Restaurant & Brewery, in the Reagan Room
2610 E. Katella Ave.
Anaheim, California 92806
(Across from the Honda Center)
Cost
The cost to attend this “Lunch ‘n’ Learn” event is $15 at the door. We are pleased to have Altium’s sponsorship to help us with the cost of the luncheon. Please RSVP no later than noon on Wednesday, July 17, so we can get a good headcount.
There are two ways to RSVP:
- Click here to RSVP
- Or email your RSVP
Thank you!
Scott McCurdy
President, IPC Designers Council, Orange County Chapter
Suggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.