-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Conecsus to Exhibit SMT Metals Waste Recycling Solutions at SMTA Ohio Expo & Tech Forum
July 8, 2019 | Conecsus, LLCEstimated reading time: 1 minute
Conecsus, LLC will exhibit at the SMTA Ohio Expo & Tech Forum on Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville, 15471 Royalton Road, Strongsville, Ohio.
Conecsus engineers will illustrate how the company processes wastes containing primarily tin, tin-zinc, lead, silver, gold, and copper, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
“Our customized programs, dealing with everything from solder dross to contaminated consumables, are not only ‘green’ and help customers manage their metals waste, but also put money back into their pockets that would otherwise have been lost,” said Thomas Mitchell, North American business manager. With patented, advanced recycling technologies, Conecsus keeps its customers compliant with local, state, and federal regulations while decreasing their carbon footprint and reportable waste streams.
About Conecsus
Founded in 1980, Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Tin-Zinc, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Located in Terrell, Texas, USA, Conecsus converts these wastes into usable metal products. Conecsus’ mission is to provide innovative and high-quality industrial byproducts management, metal recovery, and recycling options that provide world-class value and service to our customers, and display respect and stewardship toward the environment. For more information, visit www.conecsusllc.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.