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Takaya Launches Fastest Dual-Sided Flying Probe Tester
July 9, 2019 | TakayaEstimated reading time: 1 minute
Takaya’s APT-1600FD Advanced Flying Probe test system for assembled PCBAs provides average head-speed increases of up to 50% with throughput improvements of 30-50% over existing models, making it the industry’s fastest flying-probe test system. The APT-1600FD incorporates a new 10-flying-Z-axis design, including four vertical flying probes that provide unequalled access to test points where conventional angled probes fail to contact.
The APT-1600FD is the newest member of Takaya’s APT-1400F family of flying probers. Its six top-side and four bottom-side flying probes deliver unprecedented speed and performance found only from Takaya, the inventor and industry leader in flying-probe test technology for more than 25 years.
Takaya’s “soft touch” probing virtually eliminates the presence of witness marks often associated with flying probe test. To help compensate for board warpage, the system now comes equipped with a laser profiling system. Prior to testing a PCA, the surface of the board is scanned and the system automatically compensates for any warpage, guaranteeing maximum probing accuracy.
Next generation, high-precision measurement electronics are embedded in the flying heads allowing for greatly improved measurement accuracy and increased functional capabilities. The new measurement system includes multiple 4-quadrant source and measurement units, plus an AC sine and square wave generator and frequency counter, providing the ability to perform dynamic characteristic tests of components and circuits. An Enhanced Function Scanner Board and communications software make it easy to connect external instrumentation for additional functional-test capabilities.
About TEXMAC
TEXMAC, the exclusive authorized distributor of TAKAYA flying prober test systems in North America, is based in Charlotte, North Carolina, and offers a full range of sales and support services including test and programming services. Locations include facilities in the Boston, Chicago, Dallas, and Silicon Valley areas.
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Klaus Koziol - atgSuggested Items
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Smart Automation: The Journey of a Component Through an SMT Factory
04/22/2026 | Josh Casper -- Column: Smart AutomationIn electronics manufacturing, the SMT line tends to get most of the attention. Placement machines, inspection systems, screen printers, and reflow ovens often take center stage when discussing productivity improvements or new equipment investments. While these systems are obviously critical to the manufacturing process, they only represent a portion of the journey every component takes before becoming part of a finished assembly.
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.