-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
PVA Receives Patent for New Blow-Off Mechanism
July 11, 2019 | PVAEstimated reading time: 1 minute
PVA has been granted a new patent. Patent No. US 10,328,448 B2 pertains to the method of cleaning adhesive residue off of a dispensing nozzle using an integrated blow off mechanism. The mechanism uses compressed air to virtually wipe the nozzle clean vs. having to immerse in solvent or use a physical wiper or other mechanism that must contact and clean the nozzle.
“This recognition shows that PVA is not only focused on developing world class liquid dispensing and spraying devices but also improving the ancillary tools that improve application performance and maintenance of these devices,” states Jon Urquhart, Director of Application Engineering at PVA.
Urquhart added, “This cleaning mechanism provides a method to remove adhesive residue that can build up on a dispensing nozzle with a virtual wiping action from pressurized air directed at the nozzle. This development has shown to greatly improve dispensing accuracy by enabling the user to have a clean dispensing nozzle at the beginning of every dispense cycle plus eliminating the step of using a physical wiper or solvent to clean the nozzle which can be messy or require additional consumables.”
Precision Valve and Automation stands for a meticulous, custom approach to efficient and reliable conformal coating, fluid dispensing and custom automation equipment. As an innovator of high quality, state-of-the-art dispensing technology, PVA possesses the products and expertise to satisfy projects across a wide spectrum of markets.
Repeatable results in a superior quality package make PVA the choice for high reliability applications in the automotive, aerospace and defense fields. Solutions that are flexible and innovative in design draw customers from the renewable energy and medical device manufacturing markets.
About PVA
PVA is a global supplier of conformal coating systems, innovative fluid dispensing solutions and precision valve technology. PVA’s customer driven solutions are utilized worldwide in industries ranging from solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing, and consumer electronics. Throughout the changing global manufacturing landscape, PVA remains committed to providing our customers with exceptional products and industry-leading global support.
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.